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Title	Author(s)	Issue Date	Views
Anisotropic four-dimensional Neveu-Schwarz–Neveu-Schwarz string cosmology Journal:Physical Review D (Particles and Fields)	Chen, CM Harko, T Mak, MK	2001	119
Bianchi type I cosmologies in arbitrary dimensional dilaton gravities Journal:Physical Review D (Particles and Fields)	Chen, CM Harko, TC Mak, MK	2000	154
Bianchi type I cosmology in N=2, D=5 supergravity Journal:Physical Review D (Particles and Fields)	Chen, CM Harko, TC Mak, MK	2000	129
COVID‐19 and nursing research across five countries/regions: Commonalities and recommendations Journal:Research in Nursing & Health	Im, EO Sakashita, R Oh, EG Tsai, HM Chen, CM Lin, CC McCauley, L	2021	24
Effect of polyimide baking on bump resistance in flip-chip solder joints Journal:Microelectronics Reliability	Cheng, HK Feng, SPT Lai, YJ Liu, KC Wang, YL Liu, TF Chen, CM	2014	113
Electrochemical fabrication of transparent nickel hydroxide nanostructures with tunable superhydrophobicity/superhyrophilicity for 2D microchannels application Journal:Journal of Materials Chemistry A	CHANG, YH HUANG, Y-T Lo, MK Lin, CF Chen, CM Feng, SPT	2014	44
Electrodeposition of (111)-Oriented and Nanotwin-Doped Nanocrystalline Cu with Ultrahigh Strength for 3D IC Application Journal:Nanotechnology	ZHENG, Z Huang, YT WANG, Z ZHANG, M Wang, WT Chung, CC Cherng, SJ Tsai, YH Li, PC Lu, Z Chen, CM Feng, SP	2021	19
Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3 Journal:Journal of Electronic Materials	TSENG, YC LEE, H HAU, NY Feng, SPT CHEN, CM	2018	43
Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints Journal:Journal of the Electrochemical Society	Chiang, PC Shen, YA Feng, SP Chen, CM	2021	7
Exact anisotropic brane cosmologies Journal:Physical Review D (Particles and Fields)	Chen, CM Harko, TC Mak, MK	2001	159
Fabrication and characterization of interconnected grid-type dye-sensitized solar modules Journal:International Journal of Electrochemical Science	Wei, TC Feng, SP Chang, YH Cherng, SJ Lin, YJ Chen, CM Chen, HH	2012	36
Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing Journal:Journal of Electronic Materials	LAI, KC WU, PY CHEN, CM WEI, TC WU, CH Feng, SPT	2016	45
Microfluidic Applications in Drug Development: Fabrication of Drug Carriers and Drug Toxicity Screening Journal:Micromachines	Zhao, P Wang, JC Chen, CM Wang, JM Liu, GX Nandakumar, K Li, Y Wang, L	2022
Nickel substrate covered with a Sn-based protection bi-layer as a photoanode substrate for dye-sensitized solar cells Journal:Electrochimica Acta	Huang, Y Feng, SPT Chen, CM	2013	38
Nonspecular Reflection of Droplets Journal:Small	Zhu, P Chen, CM Nandakumar, K Wang, L	2021
Rotational perturbations in Neveu-Schwarz–Neveu-Schwarz string cosmology Journal:Physical Review D (Particles and Fields)	Chen, CM Harko, TC Mak, MK	2001	140
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints Journal:Microelectronics Reliability	ZHENG, Z Chiang, PC Huang, YT Wang, WT Li, PC Tsai, YH Chen, CM Feng, SP	2019	60
Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit Journal:JOM	Tsai, ST Chiang, PC Liu, C Feng, SP Chen, CM	2019	55
Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells Journal:Journal of The Electrochemical Society	Huang, Y Zhan, YY Cherng, SJ Chen, CM Feng, SPT Wei, TC	2013	57
Surface Silanization of Polyimide for Autocatalytic Metallization Journal:JOM	Liu, JN Sil, MC CHENG, R Feng, SP Chen, CM	2020	16

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