Showing results 3 to 4 of 4
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Title | Author(s) | Issue Date | |
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Optimization of bit-pairing codification with learning for 3D reconstruction Journal:International Journal of Image and Graphics | 2007 | ||
Use of paraplanar constraint for parallel inspection of wafer bump heights Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition, IPCV 2007 | 2007 |