File Download

There are no files associated with this item.

Supplementary

Conference Paper: Use of paraplanar constraint for parallel inspection of wafer bump heights

TitleUse of paraplanar constraint for parallel inspection of wafer bump heights
Authors
Issue Date2007
Persistent Identifierhttp://hdl.handle.net/10722/99806

 

DC FieldValueLanguage
dc.contributor.authorDong, Men_HK
dc.contributor.authorChung, Ren_HK
dc.contributor.authorLam, EYMen_HK
dc.contributor.authorFung, SMen_HK
dc.date.accessioned2010-09-25T18:44:55Z-
dc.date.available2010-09-25T18:44:55Z-
dc.date.issued2007en_HK
dc.identifier.urihttp://hdl.handle.net/10722/99806-
dc.languageengen_HK
dc.relation.ispartofInternational Conference on Image Processing, Computer Vision, and Pattern Recognitionen_HK
dc.titleUse of paraplanar constraint for parallel inspection of wafer bump heightsen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailLam, EYM: elam@eee.hku.hken_HK
dc.identifier.authorityLam, EYM=rp00131en_HK
dc.identifier.hkuros128186en_HK

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats