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Conference Paper: Semiconductor die defect detection using artificial vision during assembly process

TitleSemiconductor die defect detection using artificial vision during assembly process
Authors
Ng, NYLam, EYM
Issue Date2005
Citation
Regional Inter-University Postgraduate Electrical and Electronic Engineering Conference (RIUPEEEC), Hong Kong, 14-15 July 2005. In Proceedings of RIUPEEEC, 2005, p. 74-77 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/99557

 

DC FieldValueLanguage
dc.contributor.authorNg, NYen_HK
dc.contributor.authorLam, EYMen_HK
dc.date.accessioned2010-09-25T18:35:15Z-
dc.date.available2010-09-25T18:35:15Z-
dc.date.issued2005en_HK
dc.identifier.citationRegional Inter-University Postgraduate Electrical and Electronic Engineering Conference (RIUPEEEC), Hong Kong, 14-15 July 2005. In Proceedings of RIUPEEEC, 2005, p. 74-77en_HK
dc.identifier.urihttp://hdl.handle.net/10722/99557-
dc.languageengen_HK
dc.relation.ispartofProceedings of RIUPEEECen_HK
dc.titleSemiconductor die defect detection using artificial vision during assembly processen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailLam, EYM: elam@eee.hku.hken_HK
dc.identifier.authorityLam, EYM=rp00131en_HK
dc.identifier.hkuros117398en_HK
dc.identifier.spage74en_HK
dc.identifier.epage77en_HK

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