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Conference Paper: Automated inspection of solder paste by directional LED lighting

TitleAutomated inspection of solder paste by directional LED lighting
Authors
Pang, GKHChu, MH
KeywordsFuzzy system
Process automation
Solder paste printing inspection
Surface mount technology manufacturing
Issue Date2008
PublisherIEEE
Citation
The IEEE International Conference on Automation and Logistics (ICAL 2008), Qingdao, China, 1-3 September 2008. In Proceedings of ICAL, 2008, p. 232-237 How to Cite?
DOI: http://dx.doi.org/10.1109/ICAL.2008.4636152
AbstractScreen printing of solder paste is often the very first step in an SMT line in the manufacturing of PCBs. Conventional inspection method would depend on an image acquired from a camera mounted from the top. This 2D inspection of solder paste based on images is fast but is limited to defect such as bridge or no solder. Defects related to the volume of the printed solder paste or unevenness of the paste cannot be treated from a top image. The proposed method of this paper would involve the use of special directional side lighting. A sequence of four images is acquired and image processing is carried out for the edge information of the printed solder paste. A fuzzy system is developed to give a score on the quality of the solder paste. The proposed method can handle other types of defects that cannot be treated by conventional top light images. © 2008 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/99546
ISBN
9781424425037
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorPang, GKHen_HK
dc.contributor.authorChu, MHen_HK
dc.date.accessioned2010-09-25T18:34:49Z-
dc.date.available2010-09-25T18:34:49Z-
dc.date.issued2008en_HK
dc.identifier.citationThe IEEE International Conference on Automation and Logistics (ICAL 2008), Qingdao, China, 1-3 September 2008. In Proceedings of ICAL, 2008, p. 232-237en_HK
dc.identifier.isbn9781424425037-
dc.identifier.urihttp://hdl.handle.net/10722/99546-
dc.description.abstractScreen printing of solder paste is often the very first step in an SMT line in the manufacturing of PCBs. Conventional inspection method would depend on an image acquired from a camera mounted from the top. This 2D inspection of solder paste based on images is fast but is limited to defect such as bridge or no solder. Defects related to the volume of the printed solder paste or unevenness of the paste cannot be treated from a top image. The proposed method of this paper would involve the use of special directional side lighting. A sequence of four images is acquired and image processing is carried out for the edge information of the printed solder paste. A fuzzy system is developed to give a score on the quality of the solder paste. The proposed method can handle other types of defects that cannot be treated by conventional top light images. © 2008 IEEE.en_HK
dc.languageengen_HK
dc.publisherIEEE-
dc.relation.ispartofProceedings of the IEEE International Conference on Automation and Logistics, ICAL 2008en_HK
dc.rights©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.-
dc.subjectFuzzy systemen_HK
dc.subjectProcess automationen_HK
dc.subjectSolder paste printing inspectionen_HK
dc.subjectSurface mount technology manufacturingen_HK
dc.titleAutomated inspection of solder paste by directional LED lightingen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=9781424425037&volume=&spage=232&epage=237&date=2008&atitle=Automated+inspection+of+solder+paste+by+directional+LED+lighting-
dc.identifier.emailPang, GKH:gpang@eee.hku.hken_HK
dc.identifier.authorityPang, GKH=rp00162en_HK
dc.description.naturepublished_or_final_version-
dc.identifier.doi10.1109/ICAL.2008.4636152en_HK
dc.identifier.scopuseid_2-s2.0-56449097317en_HK
dc.identifier.hkuros168566en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-56449097317&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage232en_HK
dc.identifier.epage237en_HK
dc.description.otherThe IEEE International Conference on Automation and Logistics (ICAL 2008), Qingdao, China, 1-3 September 2008. In Proceedings of ICAL, 2008, p. 232-237-
dc.identifier.scopusauthoridPang, GKH=7103393283en_HK
dc.identifier.scopusauthoridChu, MH=47461010000en_HK

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