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Conference Paper: Surface orientation recovery of specular micro-surface via binary pattern projection

TitleSurface orientation recovery of specular micro-surface via binary pattern projection
Authors
KeywordsChecker Board Pattern
Grid Corners
Specular Surface
Structured Light
Surface Orientation
Issue Date2006
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
Citation
Proceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6070 How to Cite?
AbstractWith the continuous effort of the electronic industry in miniaturizing device size, the task of inspecting the various electrical parts becomes increasingly difficult. For instance, solder bumps grown on wafers for direct die-to-die bonding need to have their 3D shape inspected for assuring electrical contact and preventing damage to the processing equipments or to the dies themselves in the bonding process. Yet, the inspection task is made difficult by the tiny size and the highly specular and textureless nature of the bump surfaces. In an earlier work we proposed a mechanism for reconstructing such highly specular micro-surfaces as wafer bumps. However, the mechanism is capable of recovering 3D positions only. In this paper we describe a new mechanism that recovers surface orientations as well which are as important in describing a surface. The mechanism is based upon projecting light from a point or parallel light source to the inspected surface through a specially designed binary grid. The grid consists of a number of black and transparent blocks, resembling a checker board. By shifting the grid in space a number of times in a direction not parallel to either boundary of the grid elements, and each time taking a separate image of the illuminated surface, we could determine the surface orientations of the inspected surface at points which appear in the image data as grid corners. Experimental results on real objects are shown to illustrate the effectiveness of the proposed mechanism. © 2006 SPIE-IS&T.
Persistent Identifierhttp://hdl.handle.net/10722/99482
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorSong, Zen_HK
dc.contributor.authorChung, Ren_HK
dc.contributor.authorCheng, Jen_HK
dc.contributor.authorLam, EYen_HK
dc.date.accessioned2010-09-25T18:32:10Z-
dc.date.available2010-09-25T18:32:10Z-
dc.date.issued2006en_HK
dc.identifier.citationProceedings Of Spie - The International Society For Optical Engineering, 2006, v. 6070en_HK
dc.identifier.issn0277-786Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/99482-
dc.description.abstractWith the continuous effort of the electronic industry in miniaturizing device size, the task of inspecting the various electrical parts becomes increasingly difficult. For instance, solder bumps grown on wafers for direct die-to-die bonding need to have their 3D shape inspected for assuring electrical contact and preventing damage to the processing equipments or to the dies themselves in the bonding process. Yet, the inspection task is made difficult by the tiny size and the highly specular and textureless nature of the bump surfaces. In an earlier work we proposed a mechanism for reconstructing such highly specular micro-surfaces as wafer bumps. However, the mechanism is capable of recovering 3D positions only. In this paper we describe a new mechanism that recovers surface orientations as well which are as important in describing a surface. The mechanism is based upon projecting light from a point or parallel light source to the inspected surface through a specially designed binary grid. The grid consists of a number of black and transparent blocks, resembling a checker board. By shifting the grid in space a number of times in a direction not parallel to either boundary of the grid elements, and each time taking a separate image of the illuminated surface, we could determine the surface orientations of the inspected surface at points which appear in the image data as grid corners. Experimental results on real objects are shown to illustrate the effectiveness of the proposed mechanism. © 2006 SPIE-IS&T.en_HK
dc.languageengen_HK
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xmlen_HK
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_HK
dc.subjectChecker Board Patternen_HK
dc.subjectGrid Cornersen_HK
dc.subjectSpecular Surfaceen_HK
dc.subjectStructured Lighten_HK
dc.subjectSurface Orientationen_HK
dc.titleSurface orientation recovery of specular micro-surface via binary pattern projectionen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailLam, EY:elam@eee.hku.hken_HK
dc.identifier.authorityLam, EY=rp00131en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1117/12.650026en_HK
dc.identifier.scopuseid_2-s2.0-33645678464en_HK
dc.identifier.hkuros117404en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33645678464&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume6070en_HK
dc.identifier.spage254en_HK
dc.identifier.epage262en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridSong, Z=7402858772en_HK
dc.identifier.scopusauthoridChung, R=7202439610en_HK
dc.identifier.scopusauthoridCheng, J=14057685600en_HK
dc.identifier.scopusauthoridLam, EY=7102890004en_HK

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