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Conference Paper: An efficient stochastic integral equation method for modeling the influence of conductor surface roughness on interconnect ohmic loss

TitleAn efficient stochastic integral equation method for modeling the influence of conductor surface roughness on interconnect ohmic loss
Authors
Issue Date2007
Citation
Midwest Symposium On Circuits And Systems, 2007, p. 1417-1420 How to Cite?
AbstractDue to the shrinking skin depth in high-frequency analog and digital circuits, surface roughness now has a significant impact on interconnect ohmic loss, which tends to be ignored in conventional EDA tools. An effective conductivity (EC) has been proposed as the metric of this impact, but the large amount of computation resulted from the Monte-Carlo (MC) simulation prohibits practical use. In this paper, we propose a computationally efficient stochastic integral equation (SIE) method to statistically compute the EC as an alternative to the timeconsuming MC simulation. An effective second-order correction utilizing model order reduction (MOR) techniques is developed to substantially improve the accuracy at an acceptable cost. Numerical experiments then verify the efficacy of the proposed method. ©2007 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/99308
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorChen, Qen_HK
dc.contributor.authorWong, Nen_HK
dc.date.accessioned2010-09-25T18:24:26Z-
dc.date.available2010-09-25T18:24:26Z-
dc.date.issued2007en_HK
dc.identifier.citationMidwest Symposium On Circuits And Systems, 2007, p. 1417-1420en_HK
dc.identifier.issn1548-3746en_HK
dc.identifier.urihttp://hdl.handle.net/10722/99308-
dc.description.abstractDue to the shrinking skin depth in high-frequency analog and digital circuits, surface roughness now has a significant impact on interconnect ohmic loss, which tends to be ignored in conventional EDA tools. An effective conductivity (EC) has been proposed as the metric of this impact, but the large amount of computation resulted from the Monte-Carlo (MC) simulation prohibits practical use. In this paper, we propose a computationally efficient stochastic integral equation (SIE) method to statistically compute the EC as an alternative to the timeconsuming MC simulation. An effective second-order correction utilizing model order reduction (MOR) techniques is developed to substantially improve the accuracy at an acceptable cost. Numerical experiments then verify the efficacy of the proposed method. ©2007 IEEE.en_HK
dc.languageengen_HK
dc.relation.ispartofMidwest Symposium on Circuits and Systemsen_HK
dc.titleAn efficient stochastic integral equation method for modeling the influence of conductor surface roughness on interconnect ohmic lossen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailChen, Q: q1chen@hku.hken_HK
dc.identifier.emailWong, N: nwong@eee.hku.hken_HK
dc.identifier.authorityChen, Q=rp01688en_HK
dc.identifier.authorityWong, N=rp00190en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1109/MWSCAS.2007.4488811en_HK
dc.identifier.scopuseid_2-s2.0-51449119407en_HK
dc.identifier.hkuros133567en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-51449119407&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage1417en_HK
dc.identifier.epage1420en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridChen, Q=18133382800en_HK
dc.identifier.scopusauthoridWong, N=35235551600en_HK

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