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Conference Paper: Reduction of EMI by electric field method

TitleReduction of EMI by electric field method
Authors
Xin, WuPong, MHLee, CMQian, ZM
Issue Date1999
Citation
Conference Proceedings - Ieee Applied Power Electronics Conference And Exposition - Apec, 1999, v. 1, p. 135-138 How to Cite?
AbstractParasitic capacitance between PCB traces have severe have severe influence on EMC performance of switching mode power supply. A novel layout approach based on field mapping is proposed to reduce crosstalk problem early in PCB design stage, and emission map offer valuable visual aids to engineers. Simulation and experiment are carried out to verify this idea. A software is developed to help engineers layout noisy and victim traces.
Persistent Identifierhttp://hdl.handle.net/10722/99056

 

DC FieldValueLanguage
dc.contributor.authorXin, Wuen_HK
dc.contributor.authorPong, MHen_HK
dc.contributor.authorLee, CMen_HK
dc.contributor.authorQian, ZMen_HK
dc.date.accessioned2010-09-25T18:14:03Z-
dc.date.available2010-09-25T18:14:03Z-
dc.date.issued1999en_HK
dc.identifier.citationConference Proceedings - Ieee Applied Power Electronics Conference And Exposition - Apec, 1999, v. 1, p. 135-138en_HK
dc.identifier.urihttp://hdl.handle.net/10722/99056-
dc.description.abstractParasitic capacitance between PCB traces have severe have severe influence on EMC performance of switching mode power supply. A novel layout approach based on field mapping is proposed to reduce crosstalk problem early in PCB design stage, and emission map offer valuable visual aids to engineers. Simulation and experiment are carried out to verify this idea. A software is developed to help engineers layout noisy and victim traces.en_HK
dc.languageengen_HK
dc.relation.ispartofConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APECen_HK
dc.titleReduction of EMI by electric field methoden_HK
dc.typeConference_Paperen_HK
dc.identifier.emailPong, MH:mhp@eee.hku.hken_HK
dc.identifier.authorityPong, MH=rp00163en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-0032648809en_HK
dc.identifier.hkuros45633en_HK
dc.identifier.volume1en_HK
dc.identifier.spage135en_HK
dc.identifier.epage138en_HK
dc.identifier.scopusauthoridXin, Wu=7102977656en_HK
dc.identifier.scopusauthoridPong, MH=7003449364en_HK
dc.identifier.scopusauthoridLee, CM=7410155397en_HK
dc.identifier.scopusauthoridQian, ZM=7201384533en_HK

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