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Conference Paper: A novel design of grating projecting system for 3D reconstruction of wafer bumps
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TitleA novel design of grating projecting system for 3D reconstruction of wafer bumps
 
AuthorsShu, Y
Chung, R
Cheng, J
Lam, EYM
 
Issue Date2006
 
CitationThree-Dimensional Image Capture and Applications , v. 6056 of Proceedings of the SPIE, p. 1-10 [How to Cite?]
 
DC FieldValue
dc.contributor.authorShu, Y
 
dc.contributor.authorChung, R
 
dc.contributor.authorCheng, J
 
dc.contributor.authorLam, EYM
 
dc.date.accessioned2010-09-25T18:05:31Z
 
dc.date.available2010-09-25T18:05:31Z
 
dc.date.issued2006
 
dc.identifier.citationThree-Dimensional Image Capture and Applications , v. 6056 of Proceedings of the SPIE, p. 1-10 [How to Cite?]
 
dc.identifier.epage10
 
dc.identifier.hkuros117405
 
dc.identifier.spage1
 
dc.identifier.urihttp://hdl.handle.net/10722/98865
 
dc.identifier.volume, v. 6056 of Proceedings of the SPIE
 
dc.languageeng
 
dc.relation.ispartofThree-Dimensional Image Capture and Applications
 
dc.titleA novel design of grating projecting system for 3D reconstruction of wafer bumps
 
dc.typeConference_Paper
 
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