Conference Paper: A novel design of grating projecting system for 3D reconstruction of wafer bumps

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TitleA novel design of grating projecting system for 3D reconstruction of wafer bumps
AuthorsShu, Y
Chung, R
Cheng, J
Lam, EYM
Issue Date2006
CitationThree-Dimensional Image Capture and Applications , v. 6056 of Proceedings of the SPIE, p. 1-10 [How to Cite?]
DC Field
Value
dc.contributor.authorShu, Y
dc.contributor.authorChung, R
dc.contributor.authorCheng, J
dc.contributor.authorLam, EYM
dc.date.accessioned2010-09-25T18:05:31Z
dc.date.available2010-09-25T18:05:31Z
dc.date.issued2006
dc.identifier.citationThree-Dimensional Image Capture and Applications , v. 6056 of Proceedings of the SPIE, p. 1-10 [How to Cite?]
dc.identifier.epage10
dc.identifier.hkuros117405
dc.identifier.spage1
dc.identifier.urihttp://hdl.handle.net/10722/98865
dc.identifier.volume, v. 6056 of Proceedings of the SPIE
dc.languageeng
dc.relation.ispartofThree-Dimensional Image Capture and Applications
dc.titleA novel design of grating projecting system for 3D reconstruction of wafer bumps
dc.typeConference_Paper