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Conference Paper: Efficient numerical modeling of random rough surface effects for interconnect internal impedance extraction

TitleEfficient numerical modeling of random rough surface effects for interconnect internal impedance extraction
Authors
Issue Date2008
Citation
Proceedings Of The Asia And South Pacific Design Automation Conference, Asp-Dac, 2008, p. 152-157 How to Cite?
AbstractThis paper proposes an efficient model for numerically evaluating the impact of random surface roughness on the internal impedance for large-scale interconnect structures. The effective resistivity (ER) and effective permeability (EP) are numerically formulated to avoid the computationally prohibitive global discretization, while maintaining the model accuracy and flexibility. A modified stochastic integral equation (SIE) method is proposed to significantly speed up the computation for the mean values of ER and EP under the assumption of random surface roughness. Numerical experiments then verify the efficacy of our approach. ©2008 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/98855
References

 

DC FieldValueLanguage
dc.contributor.authorChen, Qen_HK
dc.contributor.authorWong, Nen_HK
dc.date.accessioned2010-09-25T18:05:03Z-
dc.date.available2010-09-25T18:05:03Z-
dc.date.issued2008en_HK
dc.identifier.citationProceedings Of The Asia And South Pacific Design Automation Conference, Asp-Dac, 2008, p. 152-157en_HK
dc.identifier.urihttp://hdl.handle.net/10722/98855-
dc.description.abstractThis paper proposes an efficient model for numerically evaluating the impact of random surface roughness on the internal impedance for large-scale interconnect structures. The effective resistivity (ER) and effective permeability (EP) are numerically formulated to avoid the computationally prohibitive global discretization, while maintaining the model accuracy and flexibility. A modified stochastic integral equation (SIE) method is proposed to significantly speed up the computation for the mean values of ER and EP under the assumption of random surface roughness. Numerical experiments then verify the efficacy of our approach. ©2008 IEEE.en_HK
dc.languageengen_HK
dc.relation.ispartofProceedings of the Asia and South Pacific Design Automation Conference, ASP-DACen_HK
dc.titleEfficient numerical modeling of random rough surface effects for interconnect internal impedance extractionen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailChen, Q: q1chen@hku.hken_HK
dc.identifier.emailWong, N: nwong@eee.hku.hken_HK
dc.identifier.authorityChen, Q=rp01688en_HK
dc.identifier.authorityWong, N=rp00190en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1109/ASPDAC.2008.4483930en_HK
dc.identifier.scopuseid_2-s2.0-49549123540en_HK
dc.identifier.hkuros145032en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-49549123540&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage152en_HK
dc.identifier.epage157en_HK
dc.identifier.scopusauthoridChen, Q=18133382800en_HK
dc.identifier.scopusauthoridWong, N=35235551600en_HK

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