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Conference Paper: Bond strength of self-etch adhesives to bur-cut dentin

TitleBond strength of self-etch adhesives to bur-cut dentin
Authors
Issue Date2007
PublisherBlackwell Publishing Ltd. The Journal's web site is located at http://www.blackwellpublishing.com/journals/IPD
Citation
International Journal of Paediatric Dentistry, 2007, v. 17 n. S1, p. 18 Abstract no.OS065 How to Cite?
AbstractObjective: This study examined the effects of cutting dentin withdifferent burs at various speeds on microtensile bond strength(lTBS) of two self-etch adhesive systems.Methods: Flat deep dentin surfaces from fifty extracted humanthird molars were divided into five groups according to bur typeand speed of rotation (I) high-speed diamond bur, (II) low-speeddiamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with #600grit SiC paper. A two-step self-etch adhesive, Clearfil SE Bond(SE; Kuraray) and a one-step self-etch adhesive, Clearfil S3Bond (S3; Kuraray) were applied to dentin surfaces and light-cured. Composite build-ups were performed using Filtek Z250(3M ESPE). For lTBS evaluation, composite-dentin beams of0.8 mm2were stressed to failure at a crosshead speed of1 mm/min. The lTBS data was analyzed using two-wayANOVA and Tukey’s multiple comparison tests. Representativefractured beams from each group were prepared for fracto-graphic analysis under SEM.Results: Two-way ANOVA showed that the effects of dentin surfacepreparation, adhesives systems and their interaction were statisti-cally significant (P<0.05). The lTBS were significantly loweredwhen bonding SE or S3 to dentin cut with a high-speed diamond bur(P < 0.05), which produced a thick smear layer and irregularsurface for bonding. SEM observation of the fractured surfacesrevealed mixed and adhesive failures for SE groups; while in S3groups adhesive failures with numerous inclusion droplets predo-minated.
Persistent Identifierhttp://hdl.handle.net/10722/94514
ISSN
2015 Impact Factor: 1.303
2015 SCImago Journal Rankings: 0.721

 

DC FieldValueLanguage
dc.contributor.authorYiu, CKYen_HK
dc.contributor.authorHiraishi, Nen_HK
dc.contributor.authorKing, NMen_HK
dc.date.accessioned2010-09-25T15:33:39Z-
dc.date.available2010-09-25T15:33:39Z-
dc.date.issued2007en_HK
dc.identifier.citationInternational Journal of Paediatric Dentistry, 2007, v. 17 n. S1, p. 18 Abstract no.OS065en_HK
dc.identifier.issn0960-7439en_HK
dc.identifier.urihttp://hdl.handle.net/10722/94514-
dc.description.abstractObjective: This study examined the effects of cutting dentin withdifferent burs at various speeds on microtensile bond strength(lTBS) of two self-etch adhesive systems.Methods: Flat deep dentin surfaces from fifty extracted humanthird molars were divided into five groups according to bur typeand speed of rotation (I) high-speed diamond bur, (II) low-speeddiamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with #600grit SiC paper. A two-step self-etch adhesive, Clearfil SE Bond(SE; Kuraray) and a one-step self-etch adhesive, Clearfil S3Bond (S3; Kuraray) were applied to dentin surfaces and light-cured. Composite build-ups were performed using Filtek Z250(3M ESPE). For lTBS evaluation, composite-dentin beams of0.8 mm2were stressed to failure at a crosshead speed of1 mm/min. The lTBS data was analyzed using two-wayANOVA and Tukey’s multiple comparison tests. Representativefractured beams from each group were prepared for fracto-graphic analysis under SEM.Results: Two-way ANOVA showed that the effects of dentin surfacepreparation, adhesives systems and their interaction were statisti-cally significant (P<0.05). The lTBS were significantly loweredwhen bonding SE or S3 to dentin cut with a high-speed diamond bur(P < 0.05), which produced a thick smear layer and irregularsurface for bonding. SEM observation of the fractured surfacesrevealed mixed and adhesive failures for SE groups; while in S3groups adhesive failures with numerous inclusion droplets predo-minated.-
dc.languageengen_HK
dc.publisherBlackwell Publishing Ltd. The Journal's web site is located at http://www.blackwellpublishing.com/journals/IPDen_HK
dc.relation.ispartofInternational Journal of Paediatric Dentistryen_HK
dc.rightsInternational Journal of Paediatric Dentistry. Copyright © Blackwell Publishing Ltd.en_HK
dc.titleBond strength of self-etch adhesives to bur-cut dentinen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0960-7439&volume=17&spage=P.18&epage=&date=2007&atitle=Bond+strength+of+self-etch+adhesives+to+bur-cut+dentinen_HK
dc.identifier.emailYiu, CKY: ckyyiu@hkucc.hku.hken_HK
dc.identifier.emailHiraishi, N: hiraishinoriko@yahoo.comen_HK
dc.identifier.emailKing, NM: profnigelking@mac.comen_HK
dc.identifier.authorityYiu, CKY=rp00018en_HK
dc.identifier.authorityKing, NM=rp00006en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1111/j.1365-263X.2007.00836.x-
dc.identifier.hkuros128208en_HK
dc.identifier.volume17en_HK
dc.identifier.spage18en_HK

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