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Conference Paper: Chemical-cured composite weakens bonding of adhesives by surface interaction

TitleChemical-cured composite weakens bonding of adhesives by surface interaction
Authors
Sanares, AMEItthagarun, AKing, NMTay, FRCM
Issue Date2000
Citation
The 15th Annual Scientific Meeting, Faculty of Dentistry, The University of Hong Kong, Hong Kong, 2000 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/94405

 

DC FieldValueLanguage
dc.contributor.authorSanares, AMEen_HK
dc.contributor.authorItthagarun, Aen_HK
dc.contributor.authorKing, NMen_HK
dc.contributor.authorTay, FRCMen_HK
dc.date.accessioned2010-09-25T15:30:25Z-
dc.date.available2010-09-25T15:30:25Z-
dc.date.issued2000en_HK
dc.identifier.citationThe 15th Annual Scientific Meeting, Faculty of Dentistry, The University of Hong Kong, Hong Kong, 2000-
dc.identifier.urihttp://hdl.handle.net/10722/94405-
dc.languageengen_HK
dc.relation.ispartofAnnual Scientific Meeting, Faculty of Dentistry, The University of Hong Kongen_HK
dc.titleChemical-cured composite weakens bonding of adhesives by surface interactionen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailItthagarun, A: aitthaga@hkusua.hku.hken_HK
dc.identifier.emailKing, NM: profnigelking@mac.comen_HK
dc.identifier.emailTay, FRCM: franktay@HKUCC.hku.hken_HK
dc.identifier.authorityKing, NM=rp00006en_HK
dc.identifier.hkuros53538en_HK

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