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Conference Paper: Micro-tensile bond testing of resin cements in a compliant, indirect resin composite/dentine adhesive joint (Abstract #P10)

TitleMicro-tensile bond testing of resin cements in a compliant, indirect resin composite/dentine adhesive joint (Abstract #P10)
Authors
Issue Date2001
Persistent Identifierhttp://hdl.handle.net/10722/94282

 

DC FieldValueLanguage
dc.contributor.authorMak, YFen_HK
dc.contributor.authorLai, SCNen_HK
dc.contributor.authorCheung, GSPen_HK
dc.contributor.authorChan, AWKen_HK
dc.contributor.authorTay, FRCMen_HK
dc.contributor.authorPashley, DHen_HK
dc.date.accessioned2010-09-25T15:26:47Z-
dc.date.available2010-09-25T15:26:47Z-
dc.date.issued2001en_HK
dc.identifier.urihttp://hdl.handle.net/10722/94282-
dc.languageengen_HK
dc.relation.ispartofDental Sciences for Greater China. Hong Kong-China Dental Science Symposium and 16th Annual Scientific Meeting, Faculty of Dentistry, The University of Hong Kongen_HK
dc.titleMicro-tensile bond testing of resin cements in a compliant, indirect resin composite/dentine adhesive joint (Abstract #P10)en_HK
dc.typeConference_Paperen_HK
dc.identifier.emailMak, YF: endomak@HKUCC.hku.hken_HK
dc.identifier.emailCheung, GSP: spcheung@hkusua.hku.hken_HK
dc.identifier.emailChan, AWK: awkchan@hkucc.hku.hken_HK
dc.identifier.emailTay, FRCM: franktay@HKUCC.hku.hken_HK
dc.identifier.authorityCheung, GSP=rp00016en_HK
dc.identifier.hkuros64453en_HK

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