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Conference Paper: Reversal of compromised bonding in carbamide peroxide-bleached enamel (Abstract no. 1685)

TitleReversal of compromised bonding in carbamide peroxide-bleached enamel (Abstract no. 1685)
Authors
Issue Date2002
PublisherInternational and American Associations for Dental Research. The Journal's web site is located at http://www.dentalresearch.org/publications/jdr/index.html
Citation
Journal of Dental Research, v. 81, p. A-223 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/94266
ISSN
2015 Impact Factor: 4.602
2015 SCImago Journal Rankings: 1.714

 

DC FieldValueLanguage
dc.contributor.authorLai, SCNen_HK
dc.contributor.authorTay, FRCMen_HK
dc.contributor.authorMak, YFen_HK
dc.contributor.authorCheung, GSPen_HK
dc.contributor.authorToledano, Men_HK
dc.contributor.authorOsorio, Ren_HK
dc.contributor.authorCarvalho, RMen_HK
dc.contributor.authorPashley, DHen_HK
dc.date.accessioned2010-09-25T15:26:18Z-
dc.date.available2010-09-25T15:26:18Z-
dc.date.issued2002en_HK
dc.identifier.citationJournal of Dental Research, v. 81, p. A-223en_HK
dc.identifier.issn0022-0345en_HK
dc.identifier.urihttp://hdl.handle.net/10722/94266-
dc.languageengen_HK
dc.publisherInternational and American Associations for Dental Research. The Journal's web site is located at http://www.dentalresearch.org/publications/jdr/index.htmlen_HK
dc.relation.ispartofJournal of Dental Researchen_HK
dc.titleReversal of compromised bonding in carbamide peroxide-bleached enamel (Abstract no. 1685)en_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0022-0345&volume=81&spage=A&epage=223&date=2002&atitle=Reversal+of+compromised+bonding+in+carbamide+peroxide-bleached+enamel+(Abstract+no.+1685)en_HK
dc.identifier.emailTay, FRCM: franktay@HKUCC.hku.hken_HK
dc.identifier.emailMak, YF: endomak@HKUCC.hku.hken_HK
dc.identifier.emailCheung, GSP: spcheung@hkusua.hku.hken_HK
dc.identifier.authorityCheung, GSP=rp00016en_HK
dc.identifier.hkuros68578en_HK
dc.identifier.volume, v. 81en_HK
dc.identifier.epage223en_HK

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