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Article: Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments

TitleEffects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments
Authors
KeywordsCerium Reliability
Creep Model
Intermetallic Compound
Rare Earths
Tensile Strength
Issue Date2009
PublisherElsevier BV
Citation
Journal of Rare Earths, 2009, v. 27 n. 1, p. 138-144 How to Cite?
AbstractEffect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively. It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably. Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%. After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction (XRD), scanning electron micrographs (SEM) and energy dispersive X-ray fluorescence spectrometer (EDX). Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface. © 2009 The Chinese Society of Rare Earths.
Persistent Identifierhttp://hdl.handle.net/10722/92379
ISSN
2015 Impact Factor: 2.188
2015 SCImago Journal Rankings: 0.606
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorZHANG, Len_HK
dc.contributor.authorXUE, Sen_HK
dc.contributor.authorCHEN, Yen_HK
dc.contributor.authorHAN, Zen_HK
dc.contributor.authorWANG, Jen_HK
dc.contributor.authorYU, Sen_HK
dc.contributor.authorLU, Fen_HK
dc.date.accessioned2010-09-17T10:44:20Z-
dc.date.available2010-09-17T10:44:20Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal of Rare Earths, 2009, v. 27 n. 1, p. 138-144en_HK
dc.identifier.issn1002-0721en_HK
dc.identifier.urihttp://hdl.handle.net/10722/92379-
dc.description.abstractEffect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively. It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably. Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%. After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction (XRD), scanning electron micrographs (SEM) and energy dispersive X-ray fluorescence spectrometer (EDX). Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface. © 2009 The Chinese Society of Rare Earths.en_HK
dc.languageengen_HK
dc.publisherElsevier BVen_HK
dc.relation.ispartofJournal of Rare Earthsen_HK
dc.subjectCerium Reliabilityen_HK
dc.subjectCreep Modelen_HK
dc.subjectIntermetallic Compounden_HK
dc.subjectRare Earthsen_HK
dc.subjectTensile Strengthen_HK
dc.titleEffects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experimentsen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, Y:ychenc@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp1318en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/S1002-0721(08)60208-2en_HK
dc.identifier.scopuseid_2-s2.0-62349137545en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-62349137545&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume27en_HK
dc.identifier.issue1en_HK
dc.identifier.spage138en_HK
dc.identifier.epage144en_HK
dc.identifier.isiWOS:000264902900030-

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