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Article: Effects of cerium on microstructure and properties of SnAgCu solders

TitleEffects of cerium on microstructure and properties of SnAgCu solders
Authors
KeywordsCerium
Fatigue Life
Intermetallic Compounds
Lead-Free Solder
Tensile Strength
Wettability
Issue Date2009
Citation
Zhongguo Xitu Xuebao/Journal of the Chinese Rare Earth Society, 2009, v. 27 n. 2, p. 246-250 How to Cite?
AbstractEffects of small amount of cerium on the wettability, mechanical properties, thermal fatigue performance and microstructure of SnAgCu solder were investigated by means of scanning electron microscopy (SEM) and energy dispersive X-ray analysis (EDX) systematically. The results indicated that adding a small amount of Ce could remarkably improve the wettability, mechanical strength and thermal fatigue life of SnAgCu soldered joints at room temperature. However, the addition of an excessive amount of Ce would deteriorate these properties of SnAgCu alloy. By analyzing microstructures of SnAgCu-XCe soldered joints, it was observed that a small amount of Ce in SnAgCu solder might refine the joint matrix microstructure and reduce the thickness of intermetallic compound (IMC) layer significantly because of the higher affinity of Ce to Sn in the alloy system.
Persistent Identifierhttp://hdl.handle.net/10722/92207
ISSN
2015 SCImago Journal Rankings: 0.236
References

 

DC FieldValueLanguage
dc.contributor.authorZhang, Len_HK
dc.contributor.authorXue, Sen_HK
dc.contributor.authorZeng, Gen_HK
dc.contributor.authorGao, Len_HK
dc.contributor.authorChen, Yen_HK
dc.contributor.authorSheng, Zen_HK
dc.contributor.authorYu, Sen_HK
dc.date.accessioned2010-09-17T10:39:14Z-
dc.date.available2010-09-17T10:39:14Z-
dc.date.issued2009en_HK
dc.identifier.citationZhongguo Xitu Xuebao/Journal of the Chinese Rare Earth Society, 2009, v. 27 n. 2, p. 246-250en_HK
dc.identifier.issn1000-4343en_HK
dc.identifier.urihttp://hdl.handle.net/10722/92207-
dc.description.abstractEffects of small amount of cerium on the wettability, mechanical properties, thermal fatigue performance and microstructure of SnAgCu solder were investigated by means of scanning electron microscopy (SEM) and energy dispersive X-ray analysis (EDX) systematically. The results indicated that adding a small amount of Ce could remarkably improve the wettability, mechanical strength and thermal fatigue life of SnAgCu soldered joints at room temperature. However, the addition of an excessive amount of Ce would deteriorate these properties of SnAgCu alloy. By analyzing microstructures of SnAgCu-XCe soldered joints, it was observed that a small amount of Ce in SnAgCu solder might refine the joint matrix microstructure and reduce the thickness of intermetallic compound (IMC) layer significantly because of the higher affinity of Ce to Sn in the alloy system.en_HK
dc.languageengen_HK
dc.relation.ispartofZhongguo Xitu Xuebao/Journal of the Chinese Rare Earth Societyen_HK
dc.subjectCeriumen_HK
dc.subjectFatigue Lifeen_HK
dc.subjectIntermetallic Compoundsen_HK
dc.subjectLead-Free Solderen_HK
dc.subjectTensile Strengthen_HK
dc.subjectWettabilityen_HK
dc.titleEffects of cerium on microstructure and properties of SnAgCu soldersen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, Y:ychenc@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp1318en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-65749098591en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-65749098591&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume27en_HK
dc.identifier.issue2en_HK
dc.identifier.spage246en_HK
dc.identifier.epage250en_HK

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