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Article: Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging

TitleProperties of SnAgCu/SnAgCuCe soldered joints for electronic packaging
Authors
KeywordsCerium
Cerium Compounds
Creep
Electronics Packaging
Finite Element Method
Flip Chip Devices
Intermetallics
Lead
Mechanical Properties
Packaging
Silver
Silver Alloys
Soldered Joints
Soldering
Soldering Alloys
Tensile Strength
Tin Alloys
Issue Date2010
PublisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0957-4522
Citation
Journal of Materials Science: Materials in Electronics, 2010, v. 21 n. 6, p. 635-642 How to Cite?
AbstractFor quad flat packages (QFP256), lead-free soldered joints reliability in service is a critical issue. In this paper, soldering experiments of quad flat package (QFP256) devices were carried out by means of infrared reflow soldering system with Sn-3.8Ag-0.7Cu and Sn-3.8Ag-0.7Cu-0.03Ce lead-free solders, respectively, and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR micro-joints tester. The results indicate that the tensile strength of Sn-Ag-Cu-Ce soldered joints is better than that of Sn-Ag-Cu soldered joints. In particular, the addition of trace Ce to the Sn-Ag-Cu solder can refine the microstructures and decrease the thickness of the intermetallic compound layer of Sn-Ag-Cu solder alloys. In addition, the stress-strain response of Sn-Ag-Cu/Sn-Ag-Cu-Ce soldered joints in quad flat packaging was investigated using finite element method based on Garofalo-Arrhenius model. The simulated results indicate creep distribution of soldered joints is not uniform, the heel and toe of soldered joints, the area between soldered joints and leads are the creep concentrated sites. The creep strain of Sn-Ag-Cu-Ce soldered joints is lower than that of Sn-Ag-Cu soldered joints. © Springer Science+Business Media, LLC 2009.
Persistent Identifierhttp://hdl.handle.net/10722/92159
ISSN
2015 Impact Factor: 1.798
2015 SCImago Journal Rankings: 0.553
ISI Accession Number ID
Funding AgencyGrant Number
Nanjing University of Aeronautics
Astronautics Doctoral Dissertation Innovation and Excellence Producing FoundationBCXJ09-07
Funding Information:

The authors greatly appreciate the financial support from the Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing Foundation (BCXJ09-07).

References

 

DC FieldValueLanguage
dc.contributor.authorZhang, Len_HK
dc.contributor.authorXue, S-Ben_HK
dc.contributor.authorGao, L-Len_HK
dc.contributor.authorSheng, Zen_HK
dc.contributor.authorZeng, Gen_HK
dc.contributor.authorChen, Yen_HK
dc.contributor.authorYu, S-Len_HK
dc.date.accessioned2010-09-17T10:37:49Z-
dc.date.available2010-09-17T10:37:49Z-
dc.date.issued2010en_HK
dc.identifier.citationJournal of Materials Science: Materials in Electronics, 2010, v. 21 n. 6, p. 635-642en_HK
dc.identifier.issn0957-4522en_HK
dc.identifier.urihttp://hdl.handle.net/10722/92159-
dc.description.abstractFor quad flat packages (QFP256), lead-free soldered joints reliability in service is a critical issue. In this paper, soldering experiments of quad flat package (QFP256) devices were carried out by means of infrared reflow soldering system with Sn-3.8Ag-0.7Cu and Sn-3.8Ag-0.7Cu-0.03Ce lead-free solders, respectively, and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR micro-joints tester. The results indicate that the tensile strength of Sn-Ag-Cu-Ce soldered joints is better than that of Sn-Ag-Cu soldered joints. In particular, the addition of trace Ce to the Sn-Ag-Cu solder can refine the microstructures and decrease the thickness of the intermetallic compound layer of Sn-Ag-Cu solder alloys. In addition, the stress-strain response of Sn-Ag-Cu/Sn-Ag-Cu-Ce soldered joints in quad flat packaging was investigated using finite element method based on Garofalo-Arrhenius model. The simulated results indicate creep distribution of soldered joints is not uniform, the heel and toe of soldered joints, the area between soldered joints and leads are the creep concentrated sites. The creep strain of Sn-Ag-Cu-Ce soldered joints is lower than that of Sn-Ag-Cu soldered joints. © Springer Science+Business Media, LLC 2009.en_HK
dc.languageengen_HK
dc.publisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0957-4522en_HK
dc.relation.ispartofJournal of Materials Science: Materials in Electronicsen_HK
dc.subjectCeriumen_HK
dc.subjectCerium Compoundsen_HK
dc.subjectCreepen_HK
dc.subjectElectronics Packagingen_HK
dc.subjectFinite Element Methoden_HK
dc.subjectFlip Chip Devicesen_HK
dc.subjectIntermetallicsen_HK
dc.subjectLeaden_HK
dc.subjectMechanical Propertiesen_HK
dc.subjectPackagingen_HK
dc.subjectSilveren_HK
dc.subjectSilver Alloysen_HK
dc.subjectSoldered Jointsen_HK
dc.subjectSolderingen_HK
dc.subjectSoldering Alloysen_HK
dc.subjectTensile Strengthen_HK
dc.subjectTin Alloysen_HK
dc.titleProperties of SnAgCu/SnAgCuCe soldered joints for electronic packagingen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, Y:ychenc@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp1318en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s10854-009-9969-1en_HK
dc.identifier.scopuseid_2-s2.0-77955585278en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77955585278&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume21en_HK
dc.identifier.issue6en_HK
dc.identifier.spage635en_HK
dc.identifier.epage642en_HK
dc.identifier.eissn1573-482X-
dc.identifier.isiWOS:000277415100017-
dc.identifier.citeulike5760454-

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