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Article: Determination of Anand parameters for SnAgCuCe solder

TitleDetermination of Anand parameters for SnAgCuCe solder
Authors
KeywordsCerium
Cerium Compounds
Constitutive Equations
Deformation
Finite Element Method
Parameter Estimation
Simulators
Soldered Joints
Soldering Alloys
Strain Rate
Surface Mount Technology
Issue Date2009
PublisherInstitute of Physics Publishing. The Journal's web site is located at http://www.iop.org/journals/msmse
Citation
Modelling and Simulation in Materials Science and Engineering, 2009, v. 17 n. 7 How to Cite?
AbstractA unified viscoplastic constitutive model, Anand equations, was used to represent the inelastic deformation behavior for Sn3.8Ag0.7Cu/Sn3.8Ag0.7 Cu0.03Ce solders in surface mount technology. The Anand parameters of the constitutive equations for the SnAgCu and SnAgCuCe solders were determined from separated constitutive relations and experimental results. Non-linear least-squares fitting was selected to determine the model constants. Comparisons were then made with experimental measurements of the stress-inelastic strain curves: excellent agreement was found. The model accurately predicted the overall trend of steady-state stress-strain behavior of SnAgCu and SnAgCuCe solders for the temperature ranges from -55 to 125 °C and for the strain rate range from 1% s-1 to 0.01% s-1. It is concluded that the Anand model can be applied to represent the inelastic deformation behavior of solders at high homologous temperatures and can be recommended for finite element simulation of the stress-strain response of lead-free soldered joints. Based on the Anand model, the investigations of thermo-mechanical behavior of SnAgCu and SnAgCuCe soldered joints in fine pitch quad flat package by the finite element code have been done under thermal cyclic loading, and it is found that the reliability of the SnAgCuCe soldered joints is better than that of the SnAgCu soldered joints. © 2009 IOP Publishing Ltd.
Persistent Identifierhttp://hdl.handle.net/10722/92117
ISSN
2015 Impact Factor: 1.859
2015 SCImago Journal Rankings: 1.091
ISI Accession Number ID
Funding AgencyGrant Number
Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing FoundationBCXJ09-07
Jiangsu Province06E-020
Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative PlanCX07B 087z
Funding Information:

This work was carried out with the support of the Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing Foundation (Project No BCXJ09-07), the Six Kind Skilled Personnel Project of Jiangsu Province (Project No 06E-020) and the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan (Project No CX07B 087z).

References

 

DC FieldValueLanguage
dc.contributor.authorZhang, Len_HK
dc.contributor.authorXue, Sen_HK
dc.contributor.authorGao, Len_HK
dc.contributor.authorZeng, Gen_HK
dc.contributor.authorSheng, Zen_HK
dc.contributor.authorChen, Yen_HK
dc.contributor.authorYu, Sen_HK
dc.date.accessioned2010-09-17T10:36:35Z-
dc.date.available2010-09-17T10:36:35Z-
dc.date.issued2009en_HK
dc.identifier.citationModelling and Simulation in Materials Science and Engineering, 2009, v. 17 n. 7en_HK
dc.identifier.issn0965-0393en_HK
dc.identifier.urihttp://hdl.handle.net/10722/92117-
dc.description.abstractA unified viscoplastic constitutive model, Anand equations, was used to represent the inelastic deformation behavior for Sn3.8Ag0.7Cu/Sn3.8Ag0.7 Cu0.03Ce solders in surface mount technology. The Anand parameters of the constitutive equations for the SnAgCu and SnAgCuCe solders were determined from separated constitutive relations and experimental results. Non-linear least-squares fitting was selected to determine the model constants. Comparisons were then made with experimental measurements of the stress-inelastic strain curves: excellent agreement was found. The model accurately predicted the overall trend of steady-state stress-strain behavior of SnAgCu and SnAgCuCe solders for the temperature ranges from -55 to 125 °C and for the strain rate range from 1% s-1 to 0.01% s-1. It is concluded that the Anand model can be applied to represent the inelastic deformation behavior of solders at high homologous temperatures and can be recommended for finite element simulation of the stress-strain response of lead-free soldered joints. Based on the Anand model, the investigations of thermo-mechanical behavior of SnAgCu and SnAgCuCe soldered joints in fine pitch quad flat package by the finite element code have been done under thermal cyclic loading, and it is found that the reliability of the SnAgCuCe soldered joints is better than that of the SnAgCu soldered joints. © 2009 IOP Publishing Ltd.en_HK
dc.languageengen_HK
dc.publisherInstitute of Physics Publishing. The Journal's web site is located at http://www.iop.org/journals/msmseen_HK
dc.relation.ispartofModelling and Simulation in Materials Science and Engineeringen_HK
dc.subjectCeriumen_HK
dc.subjectCerium Compoundsen_HK
dc.subjectConstitutive Equationsen_HK
dc.subjectDeformationen_HK
dc.subjectFinite Element Methoden_HK
dc.subjectParameter Estimationen_HK
dc.subjectSimulatorsen_HK
dc.subjectSoldered Jointsen_HK
dc.subjectSoldering Alloysen_HK
dc.subjectStrain Rateen_HK
dc.subjectSurface Mount Technologyen_HK
dc.titleDetermination of Anand parameters for SnAgCuCe solderen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, Y:ychenc@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp1318en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1088/0965-0393/17/7/075014en_HK
dc.identifier.scopuseid_2-s2.0-70350674879en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-70350674879&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume17en_HK
dc.identifier.issue7en_HK
dc.identifier.eissn1361-651X-
dc.identifier.isiWOS:000270055000015-

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