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Article: Effects of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys

TitleEffects of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys
Authors
KeywordsAlloys
Cerium
Cerium Alloys
Cerium Compounds
Copper Alloys
Lead
Lead Compounds
Mechanical Properties
Metal Refining
Microstructure
Phase Interfaces
Rare Earths
Scanning Electron Microscopy
Semiconducting Intermetallics
Silver
Silver Alloys
Soldering Alloys
Tensile Strength
Tin Alloys
Trace Analysis
Issue Date2009
PublisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0957-4522
Citation
Journal of Materials Science: Materials in Electronics, 2009, v. 20 n. 12, p. 1193-1199 How to Cite?
AbstractTernary lead free solder alloys Sn-Ag-Cu were considered as the promising alternatives to conventional SnPb alloys comparing with other solders. In the present work, effects of trace amounts of rare earth Ce on the wettability, mechanical properties and microstructure of Sn-Ag-Cu solder have been investigated by means of scanning electron microscopy and energy dispersive X-ray analysis systematically. The results indicate that adding trace amount of rare earth Ce can remarkably improve the wettability, mechanical strength of Sn-Ag-Cu solder joint at different temperature, especially when the content of rare earth Ce is at about 0.03%, the tensile strength will be 110% times or more than that of the lead free solder joint without rare earth Ce addition. Moreover, it was observed that the trace amount of rare earth Ce in Sn-Ag-Cu solder may refine the joint matrix microstructure, modify the Cu6Sn5 intermetallic phase at the copper substrate/ solder interface, and the intermetallic compound layer thickness was reduced significantly. In addition, since rare earth Ce possesses a higher affinity to Sn in the alloy, adding of rare earth Ce can also lead to the delayed formation and growth of the intermetallic compounds of Ag3Sn and Cu6Sn5 in the alloy. © Springer Science+Business Media, LLC 2009.
Persistent Identifierhttp://hdl.handle.net/10722/92028
ISSN
2015 Impact Factor: 1.798
2015 SCImago Journal Rankings: 0.553
ISI Accession Number ID
Funding AgencyGrant Number
Six Kind Skilled Personnel Project of Jiangsu ProvinceCX07B_087z
Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative PlanCX07B_087z
Nanjing University of Aeronautics and Astronautics Undergraduate Scientific Research Innovative
Funding Information:

The authors greatly appreciate the financial support from the Six Kind Skilled Personnel Project of Jiangsu Province (CX07B_087z), the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan (CX07B_087z), and Nanjing University of Aeronautics and Astronautics Undergraduate Scientific Research Innovative.

References

 

DC FieldValueLanguage
dc.contributor.authorZhang, Len_HK
dc.contributor.authorXue, S-Ben_HK
dc.contributor.authorGao, L-Len_HK
dc.contributor.authorChen, Yen_HK
dc.contributor.authorYu, S-Len_HK
dc.contributor.authorSheng, Zen_HK
dc.contributor.authorZeng, Gen_HK
dc.date.accessioned2010-09-17T10:33:57Z-
dc.date.available2010-09-17T10:33:57Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal of Materials Science: Materials in Electronics, 2009, v. 20 n. 12, p. 1193-1199en_HK
dc.identifier.issn0957-4522en_HK
dc.identifier.urihttp://hdl.handle.net/10722/92028-
dc.description.abstractTernary lead free solder alloys Sn-Ag-Cu were considered as the promising alternatives to conventional SnPb alloys comparing with other solders. In the present work, effects of trace amounts of rare earth Ce on the wettability, mechanical properties and microstructure of Sn-Ag-Cu solder have been investigated by means of scanning electron microscopy and energy dispersive X-ray analysis systematically. The results indicate that adding trace amount of rare earth Ce can remarkably improve the wettability, mechanical strength of Sn-Ag-Cu solder joint at different temperature, especially when the content of rare earth Ce is at about 0.03%, the tensile strength will be 110% times or more than that of the lead free solder joint without rare earth Ce addition. Moreover, it was observed that the trace amount of rare earth Ce in Sn-Ag-Cu solder may refine the joint matrix microstructure, modify the Cu6Sn5 intermetallic phase at the copper substrate/ solder interface, and the intermetallic compound layer thickness was reduced significantly. In addition, since rare earth Ce possesses a higher affinity to Sn in the alloy, adding of rare earth Ce can also lead to the delayed formation and growth of the intermetallic compounds of Ag3Sn and Cu6Sn5 in the alloy. © Springer Science+Business Media, LLC 2009.en_HK
dc.languageengen_HK
dc.publisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0957-4522en_HK
dc.relation.ispartofJournal of Materials Science: Materials in Electronicsen_HK
dc.subjectAlloysen_HK
dc.subjectCeriumen_HK
dc.subjectCerium Alloysen_HK
dc.subjectCerium Compoundsen_HK
dc.subjectCopper Alloysen_HK
dc.subjectLeaden_HK
dc.subjectLead Compoundsen_HK
dc.subjectMechanical Propertiesen_HK
dc.subjectMetal Refiningen_HK
dc.subjectMicrostructureen_HK
dc.subjectPhase Interfacesen_HK
dc.subjectRare Earthsen_HK
dc.subjectScanning Electron Microscopyen_HK
dc.subjectSemiconducting Intermetallicsen_HK
dc.subjectSilveren_HK
dc.subjectSilver Alloysen_HK
dc.subjectSoldering Alloysen_HK
dc.subjectTensile Strengthen_HK
dc.subjectTin Alloysen_HK
dc.subjectTrace Analysisen_HK
dc.titleEffects of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloysen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, Y:ychenc@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp1318en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s10854-008-9850-7en_HK
dc.identifier.scopuseid_2-s2.0-70350336742en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-70350336742&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume20en_HK
dc.identifier.issue12en_HK
dc.identifier.spage1193en_HK
dc.identifier.epage1199en_HK
dc.identifier.eissn1573-482X-
dc.identifier.isiWOS:000270780500007-
dc.identifier.citeulike3942626-

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