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Article: Transition layers at the Si O 2 SiC interface
Title | Transition layers at the Si O 2 SiC interface |
---|---|
Authors | |
Keywords | Silicon Carbide |
Issue Date | 2008 |
Publisher | American Institute of Physics. The Journal's web site is located at http://apl.aip.org/ |
Citation | Applied Physics Letters, 2008, v. 93 n. 2, article no. 022108 How to Cite? |
Abstract | The electrical performance of SiC-based microelectronic devices is strongly affected by the densities of interfacial traps introduced by the chemical and structural changes at the Si O 2 SiC interface during processing. We analyzed the structure and chemistry of this interface for the thermally grown Si O 2 4H-SiC heterostructure using high-resolution transmission electron microscopy (TEM), Z -contrast scanning TEM, and spatially resolved electron energy-loss spectroscopy. The analyses revealed the presence of distinct layers, several nanometers thick, on each side of the interface; additionally, partial amorphization of the top SiC surface was observed. These interfacial layers were attributed to the formation of a ternary Si-C-O phase during thermal oxidation. © 2008 American Institute of Physics. |
Persistent Identifier | http://hdl.handle.net/10722/91398 |
ISSN | 2023 Impact Factor: 3.5 2023 SCImago Journal Rankings: 0.976 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Zheleva, T | en_HK |
dc.contributor.author | Lelis, A | en_HK |
dc.contributor.author | Duscher, G | en_HK |
dc.contributor.author | Liu, F | en_HK |
dc.contributor.author | Levin, I | en_HK |
dc.contributor.author | Das, M | en_HK |
dc.date.accessioned | 2010-09-17T10:18:38Z | - |
dc.date.available | 2010-09-17T10:18:38Z | - |
dc.date.issued | 2008 | en_HK |
dc.identifier.citation | Applied Physics Letters, 2008, v. 93 n. 2, article no. 022108 | - |
dc.identifier.issn | 0003-6951 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/91398 | - |
dc.description.abstract | The electrical performance of SiC-based microelectronic devices is strongly affected by the densities of interfacial traps introduced by the chemical and structural changes at the Si O 2 SiC interface during processing. We analyzed the structure and chemistry of this interface for the thermally grown Si O 2 4H-SiC heterostructure using high-resolution transmission electron microscopy (TEM), Z -contrast scanning TEM, and spatially resolved electron energy-loss spectroscopy. The analyses revealed the presence of distinct layers, several nanometers thick, on each side of the interface; additionally, partial amorphization of the top SiC surface was observed. These interfacial layers were attributed to the formation of a ternary Si-C-O phase during thermal oxidation. © 2008 American Institute of Physics. | en_HK |
dc.language | eng | en_HK |
dc.publisher | American Institute of Physics. The Journal's web site is located at http://apl.aip.org/ | en_HK |
dc.relation.ispartof | Applied Physics Letters | en_HK |
dc.subject | Silicon Carbide | en_HK |
dc.title | Transition layers at the Si O 2 SiC interface | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Liu, F:fordliu@hku.hk | en_HK |
dc.identifier.authority | Liu, F=rp01358 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1063/1.2949081 | en_HK |
dc.identifier.scopus | eid_2-s2.0-47549117546 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-47549117546&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 93 | en_HK |
dc.identifier.issue | 2 | en_HK |
dc.identifier.spage | article no. 022108 | - |
dc.identifier.epage | article no. 022108 | - |
dc.identifier.isi | WOS:000257796100057 | - |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Zheleva, T=7005345636 | en_HK |
dc.identifier.scopusauthorid | Lelis, A=6603726958 | en_HK |
dc.identifier.scopusauthorid | Duscher, G=7006023463 | en_HK |
dc.identifier.scopusauthorid | Liu, F=11038795100 | en_HK |
dc.identifier.scopusauthorid | Levin, I=7202341735 | en_HK |
dc.identifier.scopusauthorid | Das, M=7402050794 | en_HK |
dc.identifier.issnl | 0003-6951 | - |