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Article: Research on the method for measuring ceramic surface residual stresses after grinding

TitleResearch on the method for measuring ceramic surface residual stresses after grinding
Authors
KeywordsEngineering Ceramics
Grinding Residual Stress
Measuring Method
Issue Date2001
Citation
Jixie Kexue Yu Jishu/Mechanical Science and Technology, 2001, v. 20 n. 5, p. 7-8+730 How to Cite?
AbstractMeasuring ceramic grinding surface residual stresses by using both corrosion method and polishing method has been proved to be a better method than the X-ray diffraction method. The results of the experiment show that for non-metal oxide ceramics the polishing method can replace X-ray diffraction after avoiding instability of signal and affiliated stresses, and so can the corrosion method after avoiding of polluting.
Persistent Identifierhttp://hdl.handle.net/10722/91140
ISSN
2006 SCImago Journal Rankings: 0.100

 

DC FieldValueLanguage
dc.contributor.authorTian, Xen_HK
dc.contributor.authorYu, Aen_HK
dc.contributor.authorLin, Ben_HK
dc.date.accessioned2010-09-17T10:13:38Z-
dc.date.available2010-09-17T10:13:38Z-
dc.date.issued2001en_HK
dc.identifier.citationJixie Kexue Yu Jishu/Mechanical Science and Technology, 2001, v. 20 n. 5, p. 7-8+730en_HK
dc.identifier.issn1003-8728en_HK
dc.identifier.urihttp://hdl.handle.net/10722/91140-
dc.description.abstractMeasuring ceramic grinding surface residual stresses by using both corrosion method and polishing method has been proved to be a better method than the X-ray diffraction method. The results of the experiment show that for non-metal oxide ceramics the polishing method can replace X-ray diffraction after avoiding instability of signal and affiliated stresses, and so can the corrosion method after avoiding of polluting.en_HK
dc.languageengen_HK
dc.relation.ispartofJixie Kexue Yu Jishu/Mechanical Science and Technologyen_HK
dc.subjectEngineering Ceramicsen_HK
dc.subjectGrinding Residual Stressen_HK
dc.subjectMeasuring Methoden_HK
dc.titleResearch on the method for measuring ceramic surface residual stresses after grindingen_HK
dc.typeArticleen_HK
dc.identifier.emailLin, B:blin@hku.hken_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-0035444552en_HK
dc.identifier.volume20en_HK
dc.identifier.issue5en_HK
dc.identifier.spage7en_HK
dc.identifier.epage8+730en_HK

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