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Article: Review of in-situ fabrication methods of piezoelectric wafer active sensor for sensing and actuation applications

TitleReview of in-situ fabrication methods of piezoelectric wafer active sensor for sensing and actuation applications
Authors
KeywordsMagneto Electric Composites
Piezoelectric Composites
Piezoelectric Wafer Active Sensors
Piezomagnetic Composites
Pvdf
Smart Sensors
Structural Health Monitoring
Issue Date2005
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedings
Citation
Proceedings of SPIE - The International Society for Optical Engineering, 2005, v. 5765 PART 2, p. 1033-1044 How to Cite?
AbstractStructural health monitoring (SHM) is important for reducing maintenance costs while increasing safety and reliability. Piezoelectric wafer active sensors (PWAS) used in SHM applications are able to detect structural damage using Lamb waves. PWAS are small, lightweight, unobtrusive, and inexpensive. PWAS achieve direct transduction between electric and elastic wave energies. PWAS are essential elements in the Lamb-wave SHM with pitch-catch, pulse-echo, and electromechanical impedance methods. Traditionally, structural integrity tests required attachment of sensors to the material surface. This is often a burdensome and time-consuming task, especially considering the size and magnitude of the surfaces measured (such as aircraft, bridges, structural supports, etc.). In addition, there are critical applications where the rigid piezoceramic wafers cannot conform to curved surfaces. Existing ceramic PWAS, while fairly accurate when attached correctly to the substance, may not provide the long term durability required for SHM. The bonded interface between the PWAS and the structure is often the durability weak link. Better durability may be obtained from a built-in sensor that is incorporated into the material. An in-situ fabricated smart sensor may offer better durability. This paper gives a review of the state of the art on the in-situ fabrication of PWAS using different approaches, such as piezoelectric composite approach; polyvinylidene fluoride (PVDF) approach. It will present the principal fabrication methods and results existing to date. Flexible PVDF PWAS have been studied. They were mounted on a cantilever beam and subjected to free vibration testing. The experimental results of the composite PWAS and PVDF PWAS have been compared with the conventional piezoceramic PWAS. The theoretical and experimental results in this study gave the basic demonstration of the piezoelectricity of composite PWAS and PVDF PWAS.
Persistent Identifierhttp://hdl.handle.net/10722/91030
ISSN
References

 

DC FieldValueLanguage
dc.contributor.authorLin, Ben_HK
dc.contributor.authorGiurgiutiu, Ven_HK
dc.date.accessioned2010-09-17T10:11:59Z-
dc.date.available2010-09-17T10:11:59Z-
dc.date.issued2005en_HK
dc.identifier.citationProceedings of SPIE - The International Society for Optical Engineering, 2005, v. 5765 PART 2, p. 1033-1044en_HK
dc.identifier.issn0277-786Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/91030-
dc.description.abstractStructural health monitoring (SHM) is important for reducing maintenance costs while increasing safety and reliability. Piezoelectric wafer active sensors (PWAS) used in SHM applications are able to detect structural damage using Lamb waves. PWAS are small, lightweight, unobtrusive, and inexpensive. PWAS achieve direct transduction between electric and elastic wave energies. PWAS are essential elements in the Lamb-wave SHM with pitch-catch, pulse-echo, and electromechanical impedance methods. Traditionally, structural integrity tests required attachment of sensors to the material surface. This is often a burdensome and time-consuming task, especially considering the size and magnitude of the surfaces measured (such as aircraft, bridges, structural supports, etc.). In addition, there are critical applications where the rigid piezoceramic wafers cannot conform to curved surfaces. Existing ceramic PWAS, while fairly accurate when attached correctly to the substance, may not provide the long term durability required for SHM. The bonded interface between the PWAS and the structure is often the durability weak link. Better durability may be obtained from a built-in sensor that is incorporated into the material. An in-situ fabricated smart sensor may offer better durability. This paper gives a review of the state of the art on the in-situ fabrication of PWAS using different approaches, such as piezoelectric composite approach; polyvinylidene fluoride (PVDF) approach. It will present the principal fabrication methods and results existing to date. Flexible PVDF PWAS have been studied. They were mounted on a cantilever beam and subjected to free vibration testing. The experimental results of the composite PWAS and PVDF PWAS have been compared with the conventional piezoceramic PWAS. The theoretical and experimental results in this study gave the basic demonstration of the piezoelectricity of composite PWAS and PVDF PWAS.en_HK
dc.languageengen_HK
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedingsen_HK
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_HK
dc.subjectMagneto Electric Compositesen_HK
dc.subjectPiezoelectric Compositesen_HK
dc.subjectPiezoelectric Wafer Active Sensorsen_HK
dc.subjectPiezomagnetic Compositesen_HK
dc.subjectPvdfen_HK
dc.subjectSmart Sensorsen_HK
dc.subjectStructural Health Monitoringen_HK
dc.titleReview of in-situ fabrication methods of piezoelectric wafer active sensor for sensing and actuation applicationsen_HK
dc.typeArticleen_HK
dc.identifier.emailLin, B:blin@hku.hken_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1117/12.597779en_HK
dc.identifier.scopuseid_2-s2.0-25144493082en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-25144493082&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume5765en_HK
dc.identifier.issuePART 2en_HK
dc.identifier.spage1033en_HK
dc.identifier.epage1044en_HK

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