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Conference Paper: Polymer thick film resistor with a dual curing system
Title | Polymer thick film resistor with a dual curing system |
---|---|
Authors | |
Keywords | Carbon Black Curing Electric Conductivity Of Solids Glass Transition Integrated Circuit Manufacture Polymerization Polymers Reaction Kinetics Resins Temperature Thick Film Circuits Ultraviolet Radiation |
Issue Date | 1999 |
Publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedings |
Citation | Proceedings of SPIE - The International Society for Optical Engineering, 1999, v. 3906, p. 489-492 How to Cite? |
Abstract | Embedding polymer passive component is an inexpensive means of burying passive components into organic substrate. The polymer pastes for passive components contain several kinds of conductive powder and additives. This investigation presents a novel approach to manufacture environmental and process friendly polymer based resistor materials by developing a screen printable solventless resin system. The study included the following: polymerization kinetics, cure profile, conductivity during cure and glass transition temperature. The polymer thick film resistor (PTFR) materials are showing excellent performance that includes dimensional stability, UV hardenable resistant traces. The benefits incurred are achieved by combining a conductive carbon black with a low viscosity, fast gel times elevated temperature combined with a long storage life time and solventless epoxy resin formulation. This process is purely additive, non-polluting and not produce waste. How the process affects the electrical properties, screen printability, and cost of the composite at the loading required to achieve the desired conductivity level must be considered to properly select a conductive carbon black. The pastes can be printed on the 400 mesh count screens, and tested from the polymer composition with a sheet resistivity of paste ranging from 10 Ω/square to 10 M Ω/square when the surface of resist traces is hardened by UV radiation and bulk polymerized by heat. |
Persistent Identifier | http://hdl.handle.net/10722/91023 |
ISSN | 2023 SCImago Journal Rankings: 0.152 |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hwang, Hui-min | en_HK |
dc.contributor.author | Chung, Chia-Tin | en_HK |
dc.contributor.author | Su, Te-Yeu | en_HK |
dc.contributor.author | Wang, Wun-Ku | en_HK |
dc.contributor.author | Wang, Hsin-Herng | en_HK |
dc.contributor.author | Lin, Bin-Yuan | en_HK |
dc.date.accessioned | 2010-09-17T10:11:53Z | - |
dc.date.available | 2010-09-17T10:11:53Z | - |
dc.date.issued | 1999 | en_HK |
dc.identifier.citation | Proceedings of SPIE - The International Society for Optical Engineering, 1999, v. 3906, p. 489-492 | en_HK |
dc.identifier.issn | 0277-786X | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/91023 | - |
dc.description.abstract | Embedding polymer passive component is an inexpensive means of burying passive components into organic substrate. The polymer pastes for passive components contain several kinds of conductive powder and additives. This investigation presents a novel approach to manufacture environmental and process friendly polymer based resistor materials by developing a screen printable solventless resin system. The study included the following: polymerization kinetics, cure profile, conductivity during cure and glass transition temperature. The polymer thick film resistor (PTFR) materials are showing excellent performance that includes dimensional stability, UV hardenable resistant traces. The benefits incurred are achieved by combining a conductive carbon black with a low viscosity, fast gel times elevated temperature combined with a long storage life time and solventless epoxy resin formulation. This process is purely additive, non-polluting and not produce waste. How the process affects the electrical properties, screen printability, and cost of the composite at the loading required to achieve the desired conductivity level must be considered to properly select a conductive carbon black. The pastes can be printed on the 400 mesh count screens, and tested from the polymer composition with a sheet resistivity of paste ranging from 10 Ω/square to 10 M Ω/square when the surface of resist traces is hardened by UV radiation and bulk polymerized by heat. | en_HK |
dc.language | eng | en_HK |
dc.publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedings | en_HK |
dc.relation.ispartof | Proceedings of SPIE - The International Society for Optical Engineering | en_HK |
dc.subject | Carbon Black | en_HK |
dc.subject | Curing | en_HK |
dc.subject | Electric Conductivity Of Solids | en_HK |
dc.subject | Glass Transition | en_HK |
dc.subject | Integrated Circuit Manufacture | en_HK |
dc.subject | Polymerization | en_HK |
dc.subject | Polymers | en_HK |
dc.subject | Reaction Kinetics | en_HK |
dc.subject | Resins | en_HK |
dc.subject | Temperature | en_HK |
dc.subject | Thick Film Circuits | en_HK |
dc.subject | Ultraviolet Radiation | en_HK |
dc.title | Polymer thick film resistor with a dual curing system | en_HK |
dc.type | Conference_Paper | en_HK |
dc.identifier.email | Lin, B:blin@hku.hk | en_HK |
dc.identifier.scopus | eid_2-s2.0-0033344351 | en_HK |
dc.identifier.volume | 3906 | en_HK |
dc.identifier.spage | 489 | en_HK |
dc.identifier.epage | 492 | en_HK |
dc.identifier.issnl | 0277-786X | - |