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Article: Polymer thick film resistor with a dual curing system

TitlePolymer thick film resistor with a dual curing system
Authors
KeywordsCarbon Black
Curing
Electric Conductivity Of Solids
Glass Transition
Integrated Circuit Manufacture
Polymerization
Polymers
Reaction Kinetics
Resins
Temperature
Thick Film Circuits
Ultraviolet Radiation
Issue Date1999
PublisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedings
Citation
Proceedings of SPIE - The International Society for Optical Engineering, 1999, v. 3906, p. 489-492 How to Cite?
AbstractEmbedding polymer passive component is an inexpensive means of burying passive components into organic substrate. The polymer pastes for passive components contain several kinds of conductive powder and additives. This investigation presents a novel approach to manufacture environmental and process friendly polymer based resistor materials by developing a screen printable solventless resin system. The study included the following: polymerization kinetics, cure profile, conductivity during cure and glass transition temperature. The polymer thick film resistor (PTFR) materials are showing excellent performance that includes dimensional stability, UV hardenable resistant traces. The benefits incurred are achieved by combining a conductive carbon black with a low viscosity, fast gel times elevated temperature combined with a long storage life time and solventless epoxy resin formulation. This process is purely additive, non-polluting and not produce waste. How the process affects the electrical properties, screen printability, and cost of the composite at the loading required to achieve the desired conductivity level must be considered to properly select a conductive carbon black. The pastes can be printed on the 400 mesh count screens, and tested from the polymer composition with a sheet resistivity of paste ranging from 10 Ω/square to 10 M Ω/square when the surface of resist traces is hardened by UV radiation and bulk polymerized by heat.
Persistent Identifierhttp://hdl.handle.net/10722/91023
ISSN

 

DC FieldValueLanguage
dc.contributor.authorHwang, Hui-minen_HK
dc.contributor.authorChung, Chia-Tinen_HK
dc.contributor.authorSu, Te-Yeuen_HK
dc.contributor.authorWang, Wun-Kuen_HK
dc.contributor.authorWang, Hsin-Herngen_HK
dc.contributor.authorLin, Bin-Yuanen_HK
dc.date.accessioned2010-09-17T10:11:53Z-
dc.date.available2010-09-17T10:11:53Z-
dc.date.issued1999en_HK
dc.identifier.citationProceedings of SPIE - The International Society for Optical Engineering, 1999, v. 3906, p. 489-492en_HK
dc.identifier.issn0277-786Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/91023-
dc.description.abstractEmbedding polymer passive component is an inexpensive means of burying passive components into organic substrate. The polymer pastes for passive components contain several kinds of conductive powder and additives. This investigation presents a novel approach to manufacture environmental and process friendly polymer based resistor materials by developing a screen printable solventless resin system. The study included the following: polymerization kinetics, cure profile, conductivity during cure and glass transition temperature. The polymer thick film resistor (PTFR) materials are showing excellent performance that includes dimensional stability, UV hardenable resistant traces. The benefits incurred are achieved by combining a conductive carbon black with a low viscosity, fast gel times elevated temperature combined with a long storage life time and solventless epoxy resin formulation. This process is purely additive, non-polluting and not produce waste. How the process affects the electrical properties, screen printability, and cost of the composite at the loading required to achieve the desired conductivity level must be considered to properly select a conductive carbon black. The pastes can be printed on the 400 mesh count screens, and tested from the polymer composition with a sheet resistivity of paste ranging from 10 Ω/square to 10 M Ω/square when the surface of resist traces is hardened by UV radiation and bulk polymerized by heat.en_HK
dc.languageengen_HK
dc.publisherS P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedingsen_HK
dc.relation.ispartofProceedings of SPIE - The International Society for Optical Engineeringen_HK
dc.subjectCarbon Blacken_HK
dc.subjectCuringen_HK
dc.subjectElectric Conductivity Of Solidsen_HK
dc.subjectGlass Transitionen_HK
dc.subjectIntegrated Circuit Manufactureen_HK
dc.subjectPolymerizationen_HK
dc.subjectPolymersen_HK
dc.subjectReaction Kineticsen_HK
dc.subjectResinsen_HK
dc.subjectTemperatureen_HK
dc.subjectThick Film Circuitsen_HK
dc.subjectUltraviolet Radiationen_HK
dc.titlePolymer thick film resistor with a dual curing systemen_HK
dc.typeArticleen_HK
dc.identifier.emailLin, B:blin@hku.hken_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-0033344351en_HK
dc.identifier.volume3906en_HK
dc.identifier.spage489en_HK
dc.identifier.epage492en_HK

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