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Article: Electrical, morphological and rheological study of melt-mixed polystyrene/copper nanowire nanocomposites
Title | Electrical, morphological and rheological study of melt-mixed polystyrene/copper nanowire nanocomposites |
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Authors | |
Keywords | Copper Nanowires Electrical Conductivity Mixing Nanocomposites Percolation Resistivity |
Issue Date | 2008 |
Publisher | Wiley - V C H Verlag GmbH & Co KGaA. The Journal's web site is located at http://www.interscience.wiley.com/jpages/0003-3146/ |
Citation | Macromolecular Materials and Engineering, 2008, v. 293 n. 7, p. 631-640 How to Cite? |
Abstract | Polystyrene and copper nanowires were melt-mixed at 200 °C and 50 rpm in 5 mL and 15 mL DSM co-rotating conical micro-compounders (DSM5 and DSM15), respectively. The electrical, morphological and rheological properties of the resulting nanocomposites were studied. The electrical percolation of nanocomposites is between 1.0 and 2.0 vol.-% for the composites prepared in DSM5 and above 2.0 vol.-% for the composites prepared in DSM15. SEM micrographs show smaller copper nanowire agglomerates inside polystyrene from DSM15 than those from DSM5. However, TEM micrographs reveal that both single copper nanowires and nanowire bundles coexist in the polymer matrix for the samples prepared in both micro-compounders. No obvious microstructure transition is detected by the dynamic rheological data at 200 °C. © 2008 WILEY-VCH Verlag GmbH & Co. KGaA. |
Persistent Identifier | http://hdl.handle.net/10722/90945 |
ISSN | 2023 Impact Factor: 4.2 2023 SCImago Journal Rankings: 0.811 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Lin, B | en_HK |
dc.contributor.author | Gelves, GA | en_HK |
dc.contributor.author | Haber, JA | en_HK |
dc.contributor.author | Pötschke, P | en_HK |
dc.contributor.author | Sundararaj, U | en_HK |
dc.date.accessioned | 2010-09-17T10:10:44Z | - |
dc.date.available | 2010-09-17T10:10:44Z | - |
dc.date.issued | 2008 | en_HK |
dc.identifier.citation | Macromolecular Materials and Engineering, 2008, v. 293 n. 7, p. 631-640 | en_HK |
dc.identifier.issn | 1438-7492 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/90945 | - |
dc.description.abstract | Polystyrene and copper nanowires were melt-mixed at 200 °C and 50 rpm in 5 mL and 15 mL DSM co-rotating conical micro-compounders (DSM5 and DSM15), respectively. The electrical, morphological and rheological properties of the resulting nanocomposites were studied. The electrical percolation of nanocomposites is between 1.0 and 2.0 vol.-% for the composites prepared in DSM5 and above 2.0 vol.-% for the composites prepared in DSM15. SEM micrographs show smaller copper nanowire agglomerates inside polystyrene from DSM15 than those from DSM5. However, TEM micrographs reveal that both single copper nanowires and nanowire bundles coexist in the polymer matrix for the samples prepared in both micro-compounders. No obvious microstructure transition is detected by the dynamic rheological data at 200 °C. © 2008 WILEY-VCH Verlag GmbH & Co. KGaA. | en_HK |
dc.language | eng | en_HK |
dc.publisher | Wiley - V C H Verlag GmbH & Co KGaA. The Journal's web site is located at http://www.interscience.wiley.com/jpages/0003-3146/ | en_HK |
dc.relation.ispartof | Macromolecular Materials and Engineering | en_HK |
dc.subject | Copper Nanowires | en_HK |
dc.subject | Electrical Conductivity | en_HK |
dc.subject | Mixing | en_HK |
dc.subject | Nanocomposites | en_HK |
dc.subject | Percolation | en_HK |
dc.subject | Resistivity | en_HK |
dc.title | Electrical, morphological and rheological study of melt-mixed polystyrene/copper nanowire nanocomposites | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Lin, B:blin@hku.hk | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1002/mame.200800045 | en_HK |
dc.identifier.scopus | eid_2-s2.0-47749143666 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-47749143666&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 293 | en_HK |
dc.identifier.issue | 7 | en_HK |
dc.identifier.spage | 631 | en_HK |
dc.identifier.epage | 640 | en_HK |
dc.identifier.eissn | 1439-2054 | - |
dc.identifier.isi | WOS:000257938800010 | - |
dc.identifier.issnl | 1438-7492 | - |