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Article: Electrical, morphological and rheological study of melt-mixed polystyrene/copper nanowire nanocomposites

TitleElectrical, morphological and rheological study of melt-mixed polystyrene/copper nanowire nanocomposites
Authors
KeywordsCopper Nanowires
Electrical Conductivity
Mixing
Nanocomposites
Percolation
Resistivity
Issue Date2008
PublisherWiley - V C H Verlag GmbH & Co KGaA. The Journal's web site is located at http://www.interscience.wiley.com/jpages/0003-3146/
Citation
Macromolecular Materials and Engineering, 2008, v. 293 n. 7, p. 631-640 How to Cite?
AbstractPolystyrene and copper nanowires were melt-mixed at 200 °C and 50 rpm in 5 mL and 15 mL DSM co-rotating conical micro-compounders (DSM5 and DSM15), respectively. The electrical, morphological and rheological properties of the resulting nanocomposites were studied. The electrical percolation of nanocomposites is between 1.0 and 2.0 vol.-% for the composites prepared in DSM5 and above 2.0 vol.-% for the composites prepared in DSM15. SEM micrographs show smaller copper nanowire agglomerates inside polystyrene from DSM15 than those from DSM5. However, TEM micrographs reveal that both single copper nanowires and nanowire bundles coexist in the polymer matrix for the samples prepared in both micro-compounders. No obvious microstructure transition is detected by the dynamic rheological data at 200 °C. © 2008 WILEY-VCH Verlag GmbH & Co. KGaA.
Persistent Identifierhttp://hdl.handle.net/10722/90945
ISSN
2015 Impact Factor: 2.834
2015 SCImago Journal Rankings: 0.865
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorLin, Ben_HK
dc.contributor.authorGelves, GAen_HK
dc.contributor.authorHaber, JAen_HK
dc.contributor.authorPötschke, Pen_HK
dc.contributor.authorSundararaj, Uen_HK
dc.date.accessioned2010-09-17T10:10:44Z-
dc.date.available2010-09-17T10:10:44Z-
dc.date.issued2008en_HK
dc.identifier.citationMacromolecular Materials and Engineering, 2008, v. 293 n. 7, p. 631-640en_HK
dc.identifier.issn1438-7492en_HK
dc.identifier.urihttp://hdl.handle.net/10722/90945-
dc.description.abstractPolystyrene and copper nanowires were melt-mixed at 200 °C and 50 rpm in 5 mL and 15 mL DSM co-rotating conical micro-compounders (DSM5 and DSM15), respectively. The electrical, morphological and rheological properties of the resulting nanocomposites were studied. The electrical percolation of nanocomposites is between 1.0 and 2.0 vol.-% for the composites prepared in DSM5 and above 2.0 vol.-% for the composites prepared in DSM15. SEM micrographs show smaller copper nanowire agglomerates inside polystyrene from DSM15 than those from DSM5. However, TEM micrographs reveal that both single copper nanowires and nanowire bundles coexist in the polymer matrix for the samples prepared in both micro-compounders. No obvious microstructure transition is detected by the dynamic rheological data at 200 °C. © 2008 WILEY-VCH Verlag GmbH & Co. KGaA.en_HK
dc.languageengen_HK
dc.publisherWiley - V C H Verlag GmbH & Co KGaA. The Journal's web site is located at http://www.interscience.wiley.com/jpages/0003-3146/en_HK
dc.relation.ispartofMacromolecular Materials and Engineeringen_HK
dc.subjectCopper Nanowiresen_HK
dc.subjectElectrical Conductivityen_HK
dc.subjectMixingen_HK
dc.subjectNanocompositesen_HK
dc.subjectPercolationen_HK
dc.subjectResistivityen_HK
dc.titleElectrical, morphological and rheological study of melt-mixed polystyrene/copper nanowire nanocompositesen_HK
dc.typeArticleen_HK
dc.identifier.emailLin, B:blin@hku.hken_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1002/mame.200800045en_HK
dc.identifier.scopuseid_2-s2.0-47749143666en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-47749143666&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume293en_HK
dc.identifier.issue7en_HK
dc.identifier.spage631en_HK
dc.identifier.epage640en_HK
dc.identifier.eissn1439-2054-
dc.identifier.isiWOS:000257938800010-

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