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Article: An experimental study on molecular dynamics simulation in nanometer grinding

TitleAn experimental study on molecular dynamics simulation in nanometer grinding
Authors
KeywordsMechanism Of Material Removal
Mechanism Of Surface Generation
Molecular Dynamics
Nanometer Grinding
Simulation Experiment
Issue Date2003
PublisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/jmatprotec
Citation
Journal of Materials Processing Technology, 2003, v. 138 n. 1-3, p. 484-488 How to Cite?
AbstractThe molecular dynamics method, which is different to continuous linear mechanics, is employed to survey the features of grinding energy dissipation, grinding forces, stress state and grinding temperature in the atomic space, and then explain the micro-scale mechanism of material removal and surface generation. The research shows that the atoms of the lattice reconstituting and some non-crystal layer are pilled up on the front of the abrasive grain, so that as a result of the continuous advancement of the abrasive grain, material is removed and formed on the grinding chips. A degenerating layer of the machined surface is formed with the reconstituting of non-crystal atoms and fracture atomic bonds, and consists of outer non-crystal and inner lattice deformation layers. © 2003 Published by Elsevier Science B.V.
Persistent Identifierhttp://hdl.handle.net/10722/90821
ISSN
2015 Impact Factor: 2.359
2015 SCImago Journal Rankings: 1.464
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorLin, Ben_HK
dc.contributor.authorYu, SYen_HK
dc.contributor.authorWang, SXen_HK
dc.date.accessioned2010-09-17T10:08:53Z-
dc.date.available2010-09-17T10:08:53Z-
dc.date.issued2003en_HK
dc.identifier.citationJournal of Materials Processing Technology, 2003, v. 138 n. 1-3, p. 484-488en_HK
dc.identifier.issn0924-0136en_HK
dc.identifier.urihttp://hdl.handle.net/10722/90821-
dc.description.abstractThe molecular dynamics method, which is different to continuous linear mechanics, is employed to survey the features of grinding energy dissipation, grinding forces, stress state and grinding temperature in the atomic space, and then explain the micro-scale mechanism of material removal and surface generation. The research shows that the atoms of the lattice reconstituting and some non-crystal layer are pilled up on the front of the abrasive grain, so that as a result of the continuous advancement of the abrasive grain, material is removed and formed on the grinding chips. A degenerating layer of the machined surface is formed with the reconstituting of non-crystal atoms and fracture atomic bonds, and consists of outer non-crystal and inner lattice deformation layers. © 2003 Published by Elsevier Science B.V.en_HK
dc.languageengen_HK
dc.publisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/jmatprotecen_HK
dc.relation.ispartofJournal of Materials Processing Technologyen_HK
dc.subjectMechanism Of Material Removalen_HK
dc.subjectMechanism Of Surface Generationen_HK
dc.subjectMolecular Dynamicsen_HK
dc.subjectNanometer Grindingen_HK
dc.subjectSimulation Experimenten_HK
dc.titleAn experimental study on molecular dynamics simulation in nanometer grindingen_HK
dc.typeArticleen_HK
dc.identifier.emailLin, B:blin@hku.hken_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/S0924-0136(03)00124-9en_HK
dc.identifier.scopuseid_2-s2.0-0038819008en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0038819008&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume138en_HK
dc.identifier.issue1-3en_HK
dc.identifier.spage484en_HK
dc.identifier.epage488en_HK
dc.identifier.isiWOS:000184856900086-

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