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Article: An experimental study on molecular dynamics simulation in nanometer grinding
Title | An experimental study on molecular dynamics simulation in nanometer grinding |
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Authors | |
Keywords | Mechanism Of Material Removal Mechanism Of Surface Generation Molecular Dynamics Nanometer Grinding Simulation Experiment |
Issue Date | 2003 |
Publisher | Elsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/jmatprotec |
Citation | Journal of Materials Processing Technology, 2003, v. 138 n. 1-3, p. 484-488 How to Cite? |
Abstract | The molecular dynamics method, which is different to continuous linear mechanics, is employed to survey the features of grinding energy dissipation, grinding forces, stress state and grinding temperature in the atomic space, and then explain the micro-scale mechanism of material removal and surface generation. The research shows that the atoms of the lattice reconstituting and some non-crystal layer are pilled up on the front of the abrasive grain, so that as a result of the continuous advancement of the abrasive grain, material is removed and formed on the grinding chips. A degenerating layer of the machined surface is formed with the reconstituting of non-crystal atoms and fracture atomic bonds, and consists of outer non-crystal and inner lattice deformation layers. © 2003 Published by Elsevier Science B.V. |
Persistent Identifier | http://hdl.handle.net/10722/90821 |
ISSN | 2023 Impact Factor: 6.7 2023 SCImago Journal Rankings: 1.579 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Lin, B | en_HK |
dc.contributor.author | Yu, SY | en_HK |
dc.contributor.author | Wang, SX | en_HK |
dc.date.accessioned | 2010-09-17T10:08:53Z | - |
dc.date.available | 2010-09-17T10:08:53Z | - |
dc.date.issued | 2003 | en_HK |
dc.identifier.citation | Journal of Materials Processing Technology, 2003, v. 138 n. 1-3, p. 484-488 | en_HK |
dc.identifier.issn | 0924-0136 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/90821 | - |
dc.description.abstract | The molecular dynamics method, which is different to continuous linear mechanics, is employed to survey the features of grinding energy dissipation, grinding forces, stress state and grinding temperature in the atomic space, and then explain the micro-scale mechanism of material removal and surface generation. The research shows that the atoms of the lattice reconstituting and some non-crystal layer are pilled up on the front of the abrasive grain, so that as a result of the continuous advancement of the abrasive grain, material is removed and formed on the grinding chips. A degenerating layer of the machined surface is formed with the reconstituting of non-crystal atoms and fracture atomic bonds, and consists of outer non-crystal and inner lattice deformation layers. © 2003 Published by Elsevier Science B.V. | en_HK |
dc.language | eng | en_HK |
dc.publisher | Elsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/jmatprotec | en_HK |
dc.relation.ispartof | Journal of Materials Processing Technology | en_HK |
dc.subject | Mechanism Of Material Removal | en_HK |
dc.subject | Mechanism Of Surface Generation | en_HK |
dc.subject | Molecular Dynamics | en_HK |
dc.subject | Nanometer Grinding | en_HK |
dc.subject | Simulation Experiment | en_HK |
dc.title | An experimental study on molecular dynamics simulation in nanometer grinding | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Lin, B:blin@hku.hk | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1016/S0924-0136(03)00124-9 | en_HK |
dc.identifier.scopus | eid_2-s2.0-0038819008 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-0038819008&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 138 | en_HK |
dc.identifier.issue | 1-3 | en_HK |
dc.identifier.spage | 484 | en_HK |
dc.identifier.epage | 488 | en_HK |
dc.identifier.isi | WOS:000184856900086 | - |
dc.identifier.issnl | 0924-0136 | - |