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Article: Shear bond strength of current adhesive systems to enamel, dentin and dentin-enamel junction region

TitleShear bond strength of current adhesive systems to enamel, dentin and dentin-enamel junction region
Authors
KeywordsChemicals And Cas Registry Numbers
Issue Date2003
PublisherOperative Dentistry. The Journal's web site is located at http://www.jopdent.org
Citation
Operative Dentistry, 2003, v. 28 n. 5, p. 585-590 How to Cite?
AbstractThis study investigated the bonding of current resin adhesives to the region approximating the dentin-enamel junction (DEJ), where the etch pattern to enamel or dentin may be different. Three kinds of tooth substrates were chosen for testing: enamel, dentin and the DEJ region. A self-etching primer system (Clearfil SE Bond) and two total-etch wet bonding systems (Single Bond and One-Step) were used. Each tooth region was bonded with one of the adhesive systems, and a resin composite and was subjected to a micro-shear bond test. In addition, morphological observations were performed on debonded specimens and etched surfaces using confocal laser scanning microscopy (CLSM). CLSM observations showed that the DEJ region was etched more deeply by phosphoric acid gel than enamel or dentin, suggesting that the action of acid etch seemed to be more intense on the DEJ. However, no statistically significant differences of shear bond strength values were observed between the DEJ region and enamel or dentin, or the adhesive systems used (p>0.05). Bonding to the DEJ is potentially as good as that to enamel or dentin.
Persistent Identifierhttp://hdl.handle.net/10722/90630
ISSN
2015 Impact Factor: 2.819
2015 SCImago Journal Rankings: 0.641
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorShimada, Yen_HK
dc.contributor.authorIwamoto, Nen_HK
dc.contributor.authorKawashima, Men_HK
dc.contributor.authorBurrow, MFen_HK
dc.contributor.authorTagami, Jen_HK
dc.date.accessioned2010-09-17T10:05:57Z-
dc.date.available2010-09-17T10:05:57Z-
dc.date.issued2003en_HK
dc.identifier.citationOperative Dentistry, 2003, v. 28 n. 5, p. 585-590en_HK
dc.identifier.issn0361-7734en_HK
dc.identifier.urihttp://hdl.handle.net/10722/90630-
dc.description.abstractThis study investigated the bonding of current resin adhesives to the region approximating the dentin-enamel junction (DEJ), where the etch pattern to enamel or dentin may be different. Three kinds of tooth substrates were chosen for testing: enamel, dentin and the DEJ region. A self-etching primer system (Clearfil SE Bond) and two total-etch wet bonding systems (Single Bond and One-Step) were used. Each tooth region was bonded with one of the adhesive systems, and a resin composite and was subjected to a micro-shear bond test. In addition, morphological observations were performed on debonded specimens and etched surfaces using confocal laser scanning microscopy (CLSM). CLSM observations showed that the DEJ region was etched more deeply by phosphoric acid gel than enamel or dentin, suggesting that the action of acid etch seemed to be more intense on the DEJ. However, no statistically significant differences of shear bond strength values were observed between the DEJ region and enamel or dentin, or the adhesive systems used (p>0.05). Bonding to the DEJ is potentially as good as that to enamel or dentin.en_HK
dc.languageengen_HK
dc.publisherOperative Dentistry. The Journal's web site is located at http://www.jopdent.orgen_HK
dc.relation.ispartofOperative Dentistryen_HK
dc.subjectChemicals And Cas Registry Numbersen_HK
dc.subject.meshAcid Etching, Dentalen_HK
dc.subject.meshAnalysis of Varianceen_HK
dc.subject.meshBisphenol A-Glycidyl Methacrylateen_HK
dc.subject.meshDental Bondingen_HK
dc.subject.meshDental Enamelen_HK
dc.subject.meshDental Stress Analysisen_HK
dc.subject.meshDentinen_HK
dc.subject.meshDentin-Bonding Agentsen_HK
dc.subject.meshHumansen_HK
dc.subject.meshMaterials Testingen_HK
dc.subject.meshMethacrylatesen_HK
dc.subject.meshMicroscopy, Confocalen_HK
dc.subject.meshMolaren_HK
dc.subject.meshResin Cementsen_HK
dc.subject.meshShear Strengthen_HK
dc.titleShear bond strength of current adhesive systems to enamel, dentin and dentin-enamel junction regionen_HK
dc.typeArticleen_HK
dc.identifier.emailBurrow, MF:mfburr58@hku.hken_HK
dc.identifier.authorityBurrow, MF=rp01306en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.pmid14531605-
dc.identifier.scopuseid_2-s2.0-0141993619en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0141993619&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume28en_HK
dc.identifier.issue5en_HK
dc.identifier.spage585en_HK
dc.identifier.epage590en_HK
dc.identifier.isiWOS:000185232500016-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridShimada, Y=7402123770en_HK
dc.identifier.scopusauthoridIwamoto, N=7101634045en_HK
dc.identifier.scopusauthoridKawashima, M=7201355014en_HK
dc.identifier.scopusauthoridBurrow, MF=7005876730en_HK
dc.identifier.scopusauthoridTagami, J=7005967527en_HK

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