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Article: Models for the structure and electronic transmission of carbon nanotubes covalently linked by a molecular bridge via amide couplings
Title | Models for the structure and electronic transmission of carbon nanotubes covalently linked by a molecular bridge via amide couplings |
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Authors | |
Issue Date | 2007 |
Publisher | American Chemical Society. The Journal's web site is located at http://pubs.acs.org/journals/jpccck/ |
Citation | The Journal of Physical Chemistry Part C: Nanomaterials and Interfaces, 2007, v. 111, p. 3700-3704 How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/80686 |
ISSN | 2023 Impact Factor: 3.3 2023 SCImago Journal Rankings: 0.957 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Ren, W | en_HK |
dc.contributor.author | Reimers, JR | en_HK |
dc.contributor.author | Hush, NS | en_HK |
dc.contributor.author | Zhu, Y | en_HK |
dc.contributor.author | Wang, J | en_HK |
dc.contributor.author | Guo, H | en_HK |
dc.date.accessioned | 2010-09-06T08:09:10Z | - |
dc.date.available | 2010-09-06T08:09:10Z | - |
dc.date.issued | 2007 | en_HK |
dc.identifier.citation | The Journal of Physical Chemistry Part C: Nanomaterials and Interfaces, 2007, v. 111, p. 3700-3704 | en_HK |
dc.identifier.issn | 1932-7447 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/80686 | - |
dc.language | eng | en_HK |
dc.publisher | American Chemical Society. The Journal's web site is located at http://pubs.acs.org/journals/jpccck/ | en_HK |
dc.relation.ispartof | The Journal of Physical Chemistry Part C: Nanomaterials and Interfaces | en_HK |
dc.title | Models for the structure and electronic transmission of carbon nanotubes covalently linked by a molecular bridge via amide couplings | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1932-7447&volume=111&spage=3700&epage=3704&date=2007&atitle=Models+for+the+structure+and+electronic+transmission+of+carbon+nanotubes+covalently+linked+by+a+molecular+bridge+via+amide+couplings | en_HK |
dc.identifier.email | Zhu, Y: eric010875@hotmail.com | en_HK |
dc.identifier.email | Wang, J: jianwang@hkusub.hku.hk | en_HK |
dc.identifier.authority | Wang, J=rp00799 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1021/jp0659958 | - |
dc.identifier.scopus | eid_2-s2.0-33947531767 | - |
dc.identifier.hkuros | 126238 | en_HK |
dc.identifier.isi | WOS:000245006000026 | - |
dc.identifier.issnl | 1932-7447 | - |