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Article: Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages

TitleFinite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages
Authors
Issue Date1998
PublisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finel
Citation
Finite Elements In Analysis And Design, 1998, v. 30 n. 1-2, p. 65-79 How to Cite?
AbstractIn this study, the finite element analysis of moisture absorption and residual stresses in plastic encapsulated IC packages is presented. During the moisture soaking test, moisture distributions in plastic encapsulated IC packages are evaluated by solving the diffusion equations. Thin LOC TSOP packages in various moisture soaking conditions are considered. The effects of temperature and humidity conditions on moisture distributions in TSOP packages are investigated in order to assess product reliability. Hygro-thermally induced deformations and stresses in plastic IC packages are also evaluated. © 1998 Elsevier Science B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/76179
ISSN
2015 Impact Factor: 2.175
2015 SCImago Journal Rankings: 1.278
References

 

DC FieldValueLanguage
dc.contributor.authorYi, Sen_HK
dc.contributor.authorSze, KYen_HK
dc.date.accessioned2010-09-06T07:18:24Z-
dc.date.available2010-09-06T07:18:24Z-
dc.date.issued1998en_HK
dc.identifier.citationFinite Elements In Analysis And Design, 1998, v. 30 n. 1-2, p. 65-79en_HK
dc.identifier.issn0168-874Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/76179-
dc.description.abstractIn this study, the finite element analysis of moisture absorption and residual stresses in plastic encapsulated IC packages is presented. During the moisture soaking test, moisture distributions in plastic encapsulated IC packages are evaluated by solving the diffusion equations. Thin LOC TSOP packages in various moisture soaking conditions are considered. The effects of temperature and humidity conditions on moisture distributions in TSOP packages are investigated in order to assess product reliability. Hygro-thermally induced deformations and stresses in plastic IC packages are also evaluated. © 1998 Elsevier Science B.V. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finelen_HK
dc.relation.ispartofFinite Elements in Analysis and Designen_HK
dc.rightsFinite Elements in Analysis and Design. Copyright © Elsevier BV.en_HK
dc.titleFinite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packagesen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0168-874X&volume=30&spage=65&epage=80&date=1998&atitle=Finite+element+analysis+of+moisture+distribution+and+hygrothermal+stresses+in+TSOP+IC+packagesen_HK
dc.identifier.emailSze, KY:szeky@graduate.hku.hken_HK
dc.identifier.authoritySze, KY=rp00171en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-0032114697en_HK
dc.identifier.hkuros41164en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0032114697&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume30en_HK
dc.identifier.issue1-2en_HK
dc.identifier.spage65en_HK
dc.identifier.epage79en_HK
dc.publisher.placeNetherlandsen_HK
dc.identifier.scopusauthoridYi, S=7201404653en_HK
dc.identifier.scopusauthoridSze, KY=7006735060en_HK

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