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Article: Energy-rate consideration in wafer bonding

TitleEnergy-rate consideration in wafer bonding
Authors
KeywordsContact mechanics
Energy rate
Finite element analysis
Wafer bonding
Issue Date2006
PublisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finel
Citation
Finite Elements In Analysis And Design, 2006, v. 42 n. 8-9, p. 709-714 How to Cite?
AbstractIn the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which "rate" refers to "area rate". A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process. © 2005 Elsevier B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/76154
ISSN
2015 Impact Factor: 2.175
2015 SCImago Journal Rankings: 1.278
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorFan, Hen_HK
dc.contributor.authorG Xu, Jen_HK
dc.contributor.authorSze, KYen_HK
dc.date.accessioned2010-09-06T07:18:09Z-
dc.date.available2010-09-06T07:18:09Z-
dc.date.issued2006en_HK
dc.identifier.citationFinite Elements In Analysis And Design, 2006, v. 42 n. 8-9, p. 709-714en_HK
dc.identifier.issn0168-874Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/76154-
dc.description.abstractIn the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which "rate" refers to "area rate". A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process. © 2005 Elsevier B.V. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finelen_HK
dc.relation.ispartofFinite Elements in Analysis and Designen_HK
dc.rightsFinite Elements in Analysis and Design. Copyright © Elsevier BV.en_HK
dc.subjectContact mechanicsen_HK
dc.subjectEnergy rateen_HK
dc.subjectFinite element analysisen_HK
dc.subjectWafer bondingen_HK
dc.titleEnergy-rate consideration in wafer bondingen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0168-874X&volume=42&spage=709&epage=714&date=2006&atitle=Energy-rate+consideration+in+wafer+bondingen_HK
dc.identifier.emailSze, KY:szeky@graduate.hku.hken_HK
dc.identifier.authoritySze, KY=rp00171en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.finel.2005.10.003en_HK
dc.identifier.scopuseid_2-s2.0-33645391542en_HK
dc.identifier.hkuros117415en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33645391542&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume42en_HK
dc.identifier.issue8-9en_HK
dc.identifier.spage709en_HK
dc.identifier.epage714en_HK
dc.identifier.isiWOS:000237216700007-
dc.publisher.placeNetherlandsen_HK
dc.identifier.scopusauthoridFan, H=7402553644en_HK
dc.identifier.scopusauthoridG Xu, J=12797880900en_HK
dc.identifier.scopusauthoridSze, KY=7006735060en_HK

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