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- Publisher Website: 10.1016/j.finel.2005.10.003
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Article: Energy-rate consideration in wafer bonding
Title | Energy-rate consideration in wafer bonding |
---|---|
Authors | |
Keywords | Contact mechanics Energy rate Finite element analysis Wafer bonding |
Issue Date | 2006 |
Publisher | Elsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finel |
Citation | Finite Elements In Analysis And Design, 2006, v. 42 n. 8-9, p. 709-714 How to Cite? |
Abstract | In the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which "rate" refers to "area rate". A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process. © 2005 Elsevier B.V. All rights reserved. |
Persistent Identifier | http://hdl.handle.net/10722/76154 |
ISSN | 2023 Impact Factor: 3.5 2023 SCImago Journal Rankings: 0.835 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Fan, H | en_HK |
dc.contributor.author | G Xu, J | en_HK |
dc.contributor.author | Sze, KY | en_HK |
dc.date.accessioned | 2010-09-06T07:18:09Z | - |
dc.date.available | 2010-09-06T07:18:09Z | - |
dc.date.issued | 2006 | en_HK |
dc.identifier.citation | Finite Elements In Analysis And Design, 2006, v. 42 n. 8-9, p. 709-714 | en_HK |
dc.identifier.issn | 0168-874X | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/76154 | - |
dc.description.abstract | In the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which "rate" refers to "area rate". A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process. © 2005 Elsevier B.V. All rights reserved. | en_HK |
dc.language | eng | en_HK |
dc.publisher | Elsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finel | en_HK |
dc.relation.ispartof | Finite Elements in Analysis and Design | en_HK |
dc.rights | Finite Elements in Analysis and Design. Copyright © Elsevier BV. | en_HK |
dc.subject | Contact mechanics | en_HK |
dc.subject | Energy rate | en_HK |
dc.subject | Finite element analysis | en_HK |
dc.subject | Wafer bonding | en_HK |
dc.title | Energy-rate consideration in wafer bonding | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0168-874X&volume=42&spage=709&epage=714&date=2006&atitle=Energy-rate+consideration+in+wafer+bonding | en_HK |
dc.identifier.email | Sze, KY:szeky@graduate.hku.hk | en_HK |
dc.identifier.authority | Sze, KY=rp00171 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1016/j.finel.2005.10.003 | en_HK |
dc.identifier.scopus | eid_2-s2.0-33645391542 | en_HK |
dc.identifier.hkuros | 117415 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-33645391542&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 42 | en_HK |
dc.identifier.issue | 8-9 | en_HK |
dc.identifier.spage | 709 | en_HK |
dc.identifier.epage | 714 | en_HK |
dc.identifier.isi | WOS:000237216700007 | - |
dc.publisher.place | Netherlands | en_HK |
dc.identifier.scopusauthorid | Fan, H=7402553644 | en_HK |
dc.identifier.scopusauthorid | G Xu, J=12797880900 | en_HK |
dc.identifier.scopusauthorid | Sze, KY=7006735060 | en_HK |
dc.identifier.issnl | 0168-874X | - |