File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Molecular dynamics modeling of diffusion bonding

TitleMolecular dynamics modeling of diffusion bonding
Authors
KeywordsDiffusion bonding
EAM potential
Interface
Molecular dynamics
Issue Date2005
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/scriptamat
Citation
Scripta Materialia, 2005, v. 52 n. 11, p. 1135-1140 How to Cite?
AbstractMolecular dynamics simulations on diffusion bonding of Cu-Ag showed that the thickness of the interfacial region depended on the stress. The interfacial region became amorphous during diffusion bonding, and it would normally transform from amorphous into crystalline structure when the structure was cooled to the room temperature. © 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/76079
ISSN
2015 Impact Factor: 3.305
2015 SCImago Journal Rankings: 2.375
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorChen, SDen_HK
dc.contributor.authorSoh, AKen_HK
dc.contributor.authorKe, FJen_HK
dc.date.accessioned2010-09-06T07:17:26Z-
dc.date.available2010-09-06T07:17:26Z-
dc.date.issued2005en_HK
dc.identifier.citationScripta Materialia, 2005, v. 52 n. 11, p. 1135-1140en_HK
dc.identifier.issn1359-6462en_HK
dc.identifier.urihttp://hdl.handle.net/10722/76079-
dc.description.abstractMolecular dynamics simulations on diffusion bonding of Cu-Ag showed that the thickness of the interfacial region depended on the stress. The interfacial region became amorphous during diffusion bonding, and it would normally transform from amorphous into crystalline structure when the structure was cooled to the room temperature. © 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/scriptamaten_HK
dc.relation.ispartofScripta Materialiaen_HK
dc.subjectDiffusion bondingen_HK
dc.subjectEAM potentialen_HK
dc.subjectInterfaceen_HK
dc.subjectMolecular dynamicsen_HK
dc.titleMolecular dynamics modeling of diffusion bondingen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1359-6462&volume=52&issue=11&spage=1135&epage=1140&date=2005&atitle=Molecular+dynamics+modeling+of+diffusion+bondingen_HK
dc.identifier.emailSoh, AK:aksoh@hkucc.hku.hken_HK
dc.identifier.authoritySoh, AK=rp00170en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.scriptamat.2005.02.004en_HK
dc.identifier.scopuseid_2-s2.0-15344346894en_HK
dc.identifier.hkuros98354en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-15344346894&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume52en_HK
dc.identifier.issue11en_HK
dc.identifier.spage1135en_HK
dc.identifier.epage1140en_HK
dc.identifier.isiWOS:000228190200011-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridChen, SD=15077853600en_HK
dc.identifier.scopusauthoridSoh, AK=7006795203en_HK
dc.identifier.scopusauthoridKe, FJ=7003607020en_HK

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats