File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Non-planar dislocations: 3D models and thermally-activated glide processes

TitleNon-planar dislocations: 3D models and thermally-activated glide processes
Authors
KeywordsAtomistic simulation
Dislocation
Plasticity
Strength
Issue Date2005
PublisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/msea
Citation
Materials Science And Engineering A, 2005, v. 400-401 n. 1-2 SUPPL., p. 25-36 How to Cite?
AbstractIn recent years, there has been a renewed interest in studying the cross-slip of screw dislocations in the simple face-centred cubic (FCC) structure. This paper serves to address parallel developments in modelling the cross-slip of screw dislocations in the body-centred cubic (BCC) structure and the ordered L12 structure. In the latter two cases, the dislocation cores have non-planar spreading offering high intrinsic Peierls stresses. The flow behaviours of these materials, such as the non-Schmid behaviour and temperature-dependence of flow stress, are largely due to the behaviours of single dislocations. 3D atomistic modelling of the minimum-energy path for the glide processes in these cases is performed with an aim to reconcile with experimentally determined activation energies for slip. © 2005 Elsevier B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/76025
ISSN
2023 Impact Factor: 6.1
2023 SCImago Journal Rankings: 1.660
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorNgan, AHWen_HK
dc.date.accessioned2010-09-06T07:16:53Z-
dc.date.available2010-09-06T07:16:53Z-
dc.date.issued2005en_HK
dc.identifier.citationMaterials Science And Engineering A, 2005, v. 400-401 n. 1-2 SUPPL., p. 25-36en_HK
dc.identifier.issn0921-5093en_HK
dc.identifier.urihttp://hdl.handle.net/10722/76025-
dc.description.abstractIn recent years, there has been a renewed interest in studying the cross-slip of screw dislocations in the simple face-centred cubic (FCC) structure. This paper serves to address parallel developments in modelling the cross-slip of screw dislocations in the body-centred cubic (BCC) structure and the ordered L12 structure. In the latter two cases, the dislocation cores have non-planar spreading offering high intrinsic Peierls stresses. The flow behaviours of these materials, such as the non-Schmid behaviour and temperature-dependence of flow stress, are largely due to the behaviours of single dislocations. 3D atomistic modelling of the minimum-energy path for the glide processes in these cases is performed with an aim to reconcile with experimentally determined activation energies for slip. © 2005 Elsevier B.V. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/mseaen_HK
dc.relation.ispartofMaterials Science and Engineering Aen_HK
dc.subjectAtomistic simulationen_HK
dc.subjectDislocationen_HK
dc.subjectPlasticityen_HK
dc.subjectStrengthen_HK
dc.titleNon-planar dislocations: 3D models and thermally-activated glide processesen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0921-5093&volume=400-401&spage=25&epage=36&date=2005&atitle=Non-planar+dislocations:+3D+models+and+thermally-activated+glide+processesen_HK
dc.identifier.emailNgan, AHW:hwngan@hkucc.hku.hken_HK
dc.identifier.authorityNgan, AHW=rp00225en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.msea.2005.03.049en_HK
dc.identifier.scopuseid_2-s2.0-21644469918en_HK
dc.identifier.hkuros116337en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-21644469918&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume400-401en_HK
dc.identifier.issue1-2 SUPPL.en_HK
dc.identifier.spage25en_HK
dc.identifier.epage36en_HK
dc.identifier.isiWOS:000230681900006-
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridNgan, AHW=7006827202en_HK
dc.identifier.issnl0921-5093-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats