File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Transient anti-plane crack problem of a functionally graded piezoelectric strip bonded to elastic layers

TitleTransient anti-plane crack problem of a functionally graded piezoelectric strip bonded to elastic layers
Authors
Chen, JSoh, AKLiu, JLiu, ZX
Issue Date2004
PublisherSpringer-Verlag Wien. The Journal's web site is located at http://www.springer.at/acta_mech
Citation
Acta Mechanica, 2004, v. 169 n. 1-4, p. 87-100 How to Cite?
DOI: http://dx.doi.org/10.1007/s00707-004-0097-y
AbstractThis paper examined the dynamic electromechanical behavior of a crack in a functionally graded piezoelectric layer bonded between two elastic layers under the combined anti-plane mechanical shear and in-plane electric impacts. Fourier cosine transforms are used to reduce the problem to the solution of a set of singular integral equations. It is found that the impermeable crack condition is more reasonable than the permeable crack condition to analyze the influence of electric loading, and the energy density factor is more acceptable than the energy release rate to be used as the fracture criterion. In addition, numerical results are also presented to show the influences of the crack position, electromechanical combination factor and material gradient parameter on the fracture behavior.
Persistent Identifierhttp://hdl.handle.net/10722/75740
ISSN
0001-5970
2023 Impact Factor: 2.3
2023 SCImago Journal Rankings: 0.558
ISI Accession Number ID
WOS:000221980900007
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorChen, Jen_HK
dc.contributor.authorSoh, AKen_HK
dc.contributor.authorLiu, Jen_HK
dc.contributor.authorLiu, ZXen_HK
dc.date.accessioned2010-09-06T07:14:06Z-
dc.date.available2010-09-06T07:14:06Z-
dc.date.issued2004en_HK
dc.identifier.citationActa Mechanica, 2004, v. 169 n. 1-4, p. 87-100en_HK
dc.identifier.issn0001-5970en_HK
dc.identifier.urihttp://hdl.handle.net/10722/75740-
dc.description.abstractThis paper examined the dynamic electromechanical behavior of a crack in a functionally graded piezoelectric layer bonded between two elastic layers under the combined anti-plane mechanical shear and in-plane electric impacts. Fourier cosine transforms are used to reduce the problem to the solution of a set of singular integral equations. It is found that the impermeable crack condition is more reasonable than the permeable crack condition to analyze the influence of electric loading, and the energy density factor is more acceptable than the energy release rate to be used as the fracture criterion. In addition, numerical results are also presented to show the influences of the crack position, electromechanical combination factor and material gradient parameter on the fracture behavior.en_HK
dc.languageengen_HK
dc.publisherSpringer-Verlag Wien. The Journal's web site is located at http://www.springer.at/acta_mechen_HK
dc.relation.ispartofActa Mechanicaen_HK
dc.titleTransient anti-plane crack problem of a functionally graded piezoelectric strip bonded to elastic layersen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0001-5970&volume=169&issue=1-4&spage=87&epage=100&date=2004&atitle=Transient+anti-plane+crack+problem+of+a+functionally+graded+piezoelectric+strip+bonded+to+elastic+layersen_HK
dc.identifier.emailSoh, AK:aksoh@hkucc.hku.hken_HK
dc.identifier.authoritySoh, AK=rp00170en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s00707-004-0097-yen_HK
dc.identifier.scopuseid_2-s2.0-3042682290en_HK
dc.identifier.hkuros98333en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-3042682290&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume169en_HK
dc.identifier.issue1-4en_HK
dc.identifier.spage87en_HK
dc.identifier.epage100en_HK
dc.identifier.isiWOS:000221980900007-
dc.publisher.placeAustriaen_HK
dc.identifier.scopusauthoridChen, J=36038004400en_HK
dc.identifier.scopusauthoridSoh, AK=7006795203en_HK
dc.identifier.scopusauthoridLiu, J=36461135600en_HK
dc.identifier.scopusauthoridLiu, ZX=7406680823en_HK
dc.identifier.issnl0001-5970-

Export via OAI-PMH Interface in XML Formats

OR

Export to Other Non-XML Formats