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Article: Enhanced diffusivity by triple junction networks

TitleEnhanced diffusivity by triple junction networks
Authors
KeywordsDiffusion
Electrodeposition
Grain boundary
Nanocrystalline material
Triple junction
Issue Date2005
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/scriptamat
Citation
Scripta Materialia, 2005, v. 52 n. 1, p. 69-73 How to Cite?
AbstractExperiments reported enormous enhancement on the grain boundary diffusivity for electro-deposited nanocrystalline materials. We propose a statistical model to quantify the enhanced diffusivity by triple junction networks. The high diffusivity along the TJ networks and the diffusant leakage into the grain boundary hold the key for this combined diffusion process. © 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/75736
ISSN
2015 Impact Factor: 3.305
2015 SCImago Journal Rankings: 2.375
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorWang, Hen_HK
dc.contributor.authorYang, Wen_HK
dc.contributor.authorNgan, AHWen_HK
dc.date.accessioned2010-09-06T07:14:04Z-
dc.date.available2010-09-06T07:14:04Z-
dc.date.issued2005en_HK
dc.identifier.citationScripta Materialia, 2005, v. 52 n. 1, p. 69-73en_HK
dc.identifier.issn1359-6462en_HK
dc.identifier.urihttp://hdl.handle.net/10722/75736-
dc.description.abstractExperiments reported enormous enhancement on the grain boundary diffusivity for electro-deposited nanocrystalline materials. We propose a statistical model to quantify the enhanced diffusivity by triple junction networks. The high diffusivity along the TJ networks and the diffusant leakage into the grain boundary hold the key for this combined diffusion process. © 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/scriptamaten_HK
dc.relation.ispartofScripta Materialiaen_HK
dc.subjectDiffusionen_HK
dc.subjectElectrodepositionen_HK
dc.subjectGrain boundaryen_HK
dc.subjectNanocrystalline materialen_HK
dc.subjectTriple junctionen_HK
dc.titleEnhanced diffusivity by triple junction networksen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1359-6462&volume=52&spage=69&epage=73&date=2005&atitle=Enhanced+diffusivity+by+triple+junction+networksen_HK
dc.identifier.emailNgan, AHW:hwngan@hkucc.hku.hken_HK
dc.identifier.authorityNgan, AHW=rp00225en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.scriptamat.2004.08.025en_HK
dc.identifier.scopuseid_2-s2.0-6344242986en_HK
dc.identifier.hkuros97475en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-6344242986&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume52en_HK
dc.identifier.issue1en_HK
dc.identifier.spage69en_HK
dc.identifier.epage73en_HK
dc.identifier.isiWOS:000224870800014-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridWang, H=7501750723en_HK
dc.identifier.scopusauthoridYang, W=7407756306en_HK
dc.identifier.scopusauthoridNgan, AHW=7006827202en_HK

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