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Article: Analysis of singular stresses in bonded bimaterial wedges by computed eigen solutions and hybrid element method

TitleAnalysis of singular stresses in bonded bimaterial wedges by computed eigen solutions and hybrid element method
Authors
KeywordsBimaterial
Crack
Finite element
Hybrid
Singularity
Stress intensity factor
Issue Date2001
PublisherJohn Wiley & Sons Ltd. The Journal's web site is located at http://www.interscience.wiley.com/jpages/1069-8299/
Citation
Communications In Numerical Methods In Engineering, 2001, v. 17 n. 7, p. 495-507 How to Cite?
AbstractThis paper concerns the determination of the singular stress fields in bonded bimaterial wedges under inplane loading. The mathematical complexity required for deriving the eigen solutions is avoided by an ad hoc developed one-dimensional finite element formulation. The computed eigen solutions are here adopted in the assumed stress fields of hybrid stress elements which are employed to determine the stress intensities. To illustrate the efficacy of the suggested procedure, stress intensities for cracks in homogeneous, interfacial cracks, bimaterial free edges and other configurations are computed and compared with the existing analytical/reference solutions. Copyright © 2001 John Wiley & Sons, Ltd.
Persistent Identifierhttp://hdl.handle.net/10722/75697
ISSN
2011 Impact Factor: 1.754
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorChen, MCen_HK
dc.contributor.authorSze, KYen_HK
dc.contributor.authorWang, HTen_HK
dc.date.accessioned2010-09-06T07:13:41Z-
dc.date.available2010-09-06T07:13:41Z-
dc.date.issued2001en_HK
dc.identifier.citationCommunications In Numerical Methods In Engineering, 2001, v. 17 n. 7, p. 495-507en_HK
dc.identifier.issn1069-8299en_HK
dc.identifier.urihttp://hdl.handle.net/10722/75697-
dc.description.abstractThis paper concerns the determination of the singular stress fields in bonded bimaterial wedges under inplane loading. The mathematical complexity required for deriving the eigen solutions is avoided by an ad hoc developed one-dimensional finite element formulation. The computed eigen solutions are here adopted in the assumed stress fields of hybrid stress elements which are employed to determine the stress intensities. To illustrate the efficacy of the suggested procedure, stress intensities for cracks in homogeneous, interfacial cracks, bimaterial free edges and other configurations are computed and compared with the existing analytical/reference solutions. Copyright © 2001 John Wiley & Sons, Ltd.en_HK
dc.languageengen_HK
dc.publisherJohn Wiley & Sons Ltd. The Journal's web site is located at http://www.interscience.wiley.com/jpages/1069-8299/en_HK
dc.relation.ispartofCommunications in Numerical Methods in Engineeringen_HK
dc.rightsCommunications in Numerical Methods in Engineering. Copyright © John Wiley & Sons Ltd.en_HK
dc.subjectBimaterialen_HK
dc.subjectCracken_HK
dc.subjectFinite elementen_HK
dc.subjectHybriden_HK
dc.subjectSingularityen_HK
dc.subjectStress intensity factoren_HK
dc.titleAnalysis of singular stresses in bonded bimaterial wedges by computed eigen solutions and hybrid element methoden_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1069-8299&volume=17&spage=495&epage=507&date=2001&atitle=Analysis+of+singular+stresses+in+bonded+bimaterial+wedges+by+computed+eigen+solutions+and+hybrid+element+methoden_HK
dc.identifier.emailSze, KY:szeky@graduate.hku.hken_HK
dc.identifier.authoritySze, KY=rp00171en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1002/cnm.425en_HK
dc.identifier.scopuseid_2-s2.0-0035392719en_HK
dc.identifier.hkuros67173en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0035392719&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume17en_HK
dc.identifier.issue7en_HK
dc.identifier.spage495en_HK
dc.identifier.epage507en_HK
dc.identifier.isiWOS:000170106100006-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridChen, MC=7406354083en_HK
dc.identifier.scopusauthoridSze, KY=7006735060en_HK
dc.identifier.scopusauthoridWang, HT=7501734920en_HK

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