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Article: Corrosion behaviors of nanocrystalline and conventional polycrystalline copper

TitleCorrosion behaviors of nanocrystalline and conventional polycrystalline copper
Authors
Yu, JKHan, EHLu, LWei, XJLeung, M
Issue Date2005
PublisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0022-2461
Citation
Journal Of Materials Science, 2005, v. 40 n. 4, p. 1019-1022 How to Cite?
DOI: http://dx.doi.org/10.1007/s10853-005-6524-1
AbstractThe corrosion behavior of nanocrystalline and polycrystalline copper samples, fabricated by electrodeposition with an electrolyte of CuSO 4, was investigated. The fluctuating current transients and current noise power spectrum on the polycrystalline copper surface indicated the frequent initiation, growth and passivation process of metastable pits. The results showed that the surface of the nanocrystalline copper is more active during initial immersion, leading to the formation of a passive film quickly. The uniform passive film then protects the nanocrystalline copper from the further corrosion.
Persistent Identifierhttp://hdl.handle.net/10722/75654
ISSN
0022-2461
2023 Impact Factor: 3.5
2023 SCImago Journal Rankings: 0.781
ISI Accession Number ID
WOS:000227282200027
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorYu, JKen_HK
dc.contributor.authorHan, EHen_HK
dc.contributor.authorLu, Len_HK
dc.contributor.authorWei, XJen_HK
dc.contributor.authorLeung, Men_HK
dc.date.accessioned2010-09-06T07:13:16Z-
dc.date.available2010-09-06T07:13:16Z-
dc.date.issued2005en_HK
dc.identifier.citationJournal Of Materials Science, 2005, v. 40 n. 4, p. 1019-1022en_HK
dc.identifier.issn0022-2461en_HK
dc.identifier.urihttp://hdl.handle.net/10722/75654-
dc.description.abstractThe corrosion behavior of nanocrystalline and polycrystalline copper samples, fabricated by electrodeposition with an electrolyte of CuSO 4, was investigated. The fluctuating current transients and current noise power spectrum on the polycrystalline copper surface indicated the frequent initiation, growth and passivation process of metastable pits. The results showed that the surface of the nanocrystalline copper is more active during initial immersion, leading to the formation of a passive film quickly. The uniform passive film then protects the nanocrystalline copper from the further corrosion.en_HK
dc.languageengen_HK
dc.publisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0022-2461en_HK
dc.relation.ispartofJournal of Materials Scienceen_HK
dc.titleCorrosion behaviors of nanocrystalline and conventional polycrystalline copperen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0022-2461&volume=40&issue=4&spage=1019&epage=1022&date=2005&atitle=Corrosion+behaviors+of+nanocrystalline+and+conventional+polycrystalline+copperen_HK
dc.identifier.emailLeung, M:en_HK
dc.identifier.authorityLeung, M=rp00148en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s10853-005-6524-1en_HK
dc.identifier.scopuseid_2-s2.0-16244392457en_HK
dc.identifier.hkuros100084en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-16244392457&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume40en_HK
dc.identifier.issue4en_HK
dc.identifier.spage1019en_HK
dc.identifier.epage1022en_HK
dc.identifier.isiWOS:000227282200027-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridYu, JK=7405526095en_HK
dc.identifier.scopusauthoridHan, EH=7101875388en_HK
dc.identifier.scopusauthoridLu, L=55257185900en_HK
dc.identifier.scopusauthoridWei, XJ=7402117072en_HK
dc.identifier.scopusauthoridLeung, M=8862966600en_HK
dc.identifier.citeulike144642-
dc.identifier.issnl0022-2461-

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