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Article: Trefftz solutions for piezoelectricity by lekhnitskii's formalism and boundary-collocation method

TitleTrefftz solutions for piezoelectricity by lekhnitskii's formalism and boundary-collocation method
Authors
KeywordsCracks
Elliptical voids
Lekhnitskii's formalism
Piezoelectricity
Trefftz
Issue Date2006
PublisherJohn Wiley & Sons Ltd. The Journal's web site is located at http://www3.interscience.wiley.com/cgi-bin/jhome/1430
Citation
International Journal For Numerical Methods In Engineering, 2006, v. 65 n. 13, p. 2113-2138 How to Cite?
AbstractIn this paper, a solution procedure for plane piezoelectricity is developed by Trefftz boundary-collocation method. Starting with the general plane piezoelectricity solution derived by Lekhnitskii's formalism, the basic sets of Trefftz functions which satisfy the homogeneous governing equations are derived. Moreover, special sets of Trefftz functions are derived for impermeable elliptical voids, impermeable sharp cracks and permeable sharp cracks with arbitrary orientations with respect to the material poling direction. The functions in the special sets satisfy not only the homogeneous governing equations but also the boundary conditions at the peripheries of the pertinent defects. By adopting Trefftz functions as the trial functions, multi-domain Trefftz boundary-collocation method is formulated. Numerical examples are presented to illustrate the efficacy of the formulation. Copyright © 2005 John Wiley & Sons, Ltd.
Persistent Identifierhttp://hdl.handle.net/10722/75524
ISSN
2015 Impact Factor: 2.1
2015 SCImago Journal Rankings: 2.007
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorSheng, Nen_HK
dc.contributor.authorSze, KYen_HK
dc.contributor.authorCheung, YKen_HK
dc.date.accessioned2010-09-06T07:12:01Z-
dc.date.available2010-09-06T07:12:01Z-
dc.date.issued2006en_HK
dc.identifier.citationInternational Journal For Numerical Methods In Engineering, 2006, v. 65 n. 13, p. 2113-2138en_HK
dc.identifier.issn0029-5981en_HK
dc.identifier.urihttp://hdl.handle.net/10722/75524-
dc.description.abstractIn this paper, a solution procedure for plane piezoelectricity is developed by Trefftz boundary-collocation method. Starting with the general plane piezoelectricity solution derived by Lekhnitskii's formalism, the basic sets of Trefftz functions which satisfy the homogeneous governing equations are derived. Moreover, special sets of Trefftz functions are derived for impermeable elliptical voids, impermeable sharp cracks and permeable sharp cracks with arbitrary orientations with respect to the material poling direction. The functions in the special sets satisfy not only the homogeneous governing equations but also the boundary conditions at the peripheries of the pertinent defects. By adopting Trefftz functions as the trial functions, multi-domain Trefftz boundary-collocation method is formulated. Numerical examples are presented to illustrate the efficacy of the formulation. Copyright © 2005 John Wiley & Sons, Ltd.en_HK
dc.languageengen_HK
dc.publisherJohn Wiley & Sons Ltd. The Journal's web site is located at http://www3.interscience.wiley.com/cgi-bin/jhome/1430en_HK
dc.relation.ispartofInternational Journal for Numerical Methods in Engineeringen_HK
dc.rightsInternational Journal for Numerical Methods in Engineering. Copyright © John Wiley & Sons Ltd.en_HK
dc.subjectCracksen_HK
dc.subjectElliptical voidsen_HK
dc.subjectLekhnitskii's formalismen_HK
dc.subjectPiezoelectricityen_HK
dc.subjectTrefftzen_HK
dc.titleTrefftz solutions for piezoelectricity by lekhnitskii's formalism and boundary-collocation methoden_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0029-5981&volume=65&spage=2113&epage=2138&date=2006&atitle=Trefftz+solutions+for+piezoelectricity+by+Lekhnitskii%27s+Formalism+and+boundary-collocation+methoden_HK
dc.identifier.emailSze, KY:szeky@graduate.hku.hken_HK
dc.identifier.emailCheung, YK:hreccyk@hkucc.hku.hken_HK
dc.identifier.authoritySze, KY=rp00171en_HK
dc.identifier.authorityCheung, YK=rp00104en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1002/nme.1523en_HK
dc.identifier.scopuseid_2-s2.0-33645276289en_HK
dc.identifier.hkuros117412en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33645276289&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume65en_HK
dc.identifier.issue13en_HK
dc.identifier.spage2113en_HK
dc.identifier.epage2138en_HK
dc.identifier.isiWOS:000236566800001-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridSheng, N=55259181300en_HK
dc.identifier.scopusauthoridSze, KY=7006735060en_HK
dc.identifier.scopusauthoridCheung, YK=7202111065en_HK

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