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Article: A holonic architecture of the concurrent integrated process planning system

TitleA holonic architecture of the concurrent integrated process planning system
Authors
Zhang, JGao, LChan, FTSLi, P
KeywordsCAD
CORBA
Holon
Integration
Process planning
Production scheduling
Issue Date2003
PublisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/jmatprotec
Citation
Journal Of Materials Processing Technology, 2003, v. 139 n. 1-3 SPEC, p. 267-272 How to Cite?
DOI: http://dx.doi.org/10.1016/S0924-0136(03)00233-4
AbstractThis paper describes a conceptual architecture of applying holon to process planning (PP) for integrating design, PP, and shop floor scheduling so that a concurrent integrated process planning system (CIPPS) is constructed. The problem in PP has been mapped onto a holonic architecture based on multistage cooperation. A holonic architecture for CIPPS integrates all the activities of PP into a distributed intelligent open environment. Holons for CIPPS can be organized dynamically, and cooperate with each other to perform an appointed task flexibly. In addition, using CORBA technology, a prototype system of the CIPPS is implemented. © 2003 Elsevier Science B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/74549
ISSN
0924-0136
2023 Impact Factor: 6.7
2023 SCImago Journal Rankings: 1.579
ISI Accession Number ID
WOS:000184438800045
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorZhang, Jen_HK
dc.contributor.authorGao, Len_HK
dc.contributor.authorChan, FTSen_HK
dc.contributor.authorLi, Pen_HK
dc.date.accessioned2010-09-06T07:02:26Z-
dc.date.available2010-09-06T07:02:26Z-
dc.date.issued2003en_HK
dc.identifier.citationJournal Of Materials Processing Technology, 2003, v. 139 n. 1-3 SPEC, p. 267-272en_HK
dc.identifier.issn0924-0136en_HK
dc.identifier.urihttp://hdl.handle.net/10722/74549-
dc.description.abstractThis paper describes a conceptual architecture of applying holon to process planning (PP) for integrating design, PP, and shop floor scheduling so that a concurrent integrated process planning system (CIPPS) is constructed. The problem in PP has been mapped onto a holonic architecture based on multistage cooperation. A holonic architecture for CIPPS integrates all the activities of PP into a distributed intelligent open environment. Holons for CIPPS can be organized dynamically, and cooperate with each other to perform an appointed task flexibly. In addition, using CORBA technology, a prototype system of the CIPPS is implemented. © 2003 Elsevier Science B.V. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier SA. The Journal's web site is located at http://www.elsevier.com/locate/jmatprotecen_HK
dc.relation.ispartofJournal of Materials Processing Technologyen_HK
dc.subjectCADen_HK
dc.subjectCORBAen_HK
dc.subjectHolonen_HK
dc.subjectIntegrationen_HK
dc.subjectProcess planningen_HK
dc.subjectProduction schedulingen_HK
dc.titleA holonic architecture of the concurrent integrated process planning systemen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0924-0136&volume=139&issue=1-3&spage=267&epage=272&date=2003&atitle=A+holonic+architecture+of+the+concurrent+integrated+process+planning+systemen_HK
dc.identifier.emailChan, FTS: ftschan@hkucc.hku.hken_HK
dc.identifier.authorityChan, FTS=rp00090en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/S0924-0136(03)00233-4en_HK
dc.identifier.scopuseid_2-s2.0-0038787545en_HK
dc.identifier.hkuros80628en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0038787545&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume139en_HK
dc.identifier.issue1-3 SPECen_HK
dc.identifier.spage267en_HK
dc.identifier.epage272en_HK
dc.identifier.isiWOS:000184438800045-
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridZhang, J=36066837600en_HK
dc.identifier.scopusauthoridGao, L=7401800827en_HK
dc.identifier.scopusauthoridChan, FTS=7202586517en_HK
dc.identifier.scopusauthoridLi, P=7404774186en_HK
dc.identifier.issnl0924-0136-

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