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Article: Solder paste inspection using region-based defect detection

TitleSolder paste inspection using region-based defect detection
Authors
KeywordsClassification
Feature extraction
Geometric segmentation
Inspection
Solder paste defects
Issue Date2009
PublisherSpringer U K. The Journal's web site is located at http://www.springer.com/engineering/production+eng/journal/170
Citation
International Journal Of Advanced Manufacturing Technology, 2009, v. 42 n. 7-8, p. 725-734 How to Cite?
AbstractThis paper introduces a new method to detect for solder paste defects on printed circuit board. This method not only recognizes volumetric defect but also shape deformity. It involves the use of the region-based classification technique. The 3D profile of solder paste block is first reconstructed using phase shift profilometry. The reconstructed 3D profile is then divided into several regions by geometric segmentation. The resulted regions include edges and top surface. Several features which represent their regions most are extracted and analyzed from the solder paste blocks. Regional classifiers are applied to process these feature spaces. The classifier outputs are then combined to form final detection result for each solder paste block. The performance of the region-based defect detection method is evaluated using 150 and 200 μm solder paste blocks. © 2008 Springer-Verlag London Limited.
Persistent Identifierhttp://hdl.handle.net/10722/74017
ISSN
2015 Impact Factor: 1.568
2015 SCImago Journal Rankings: 0.915
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorHui, TWen_HK
dc.contributor.authorPang, GKHen_HK
dc.date.accessioned2010-09-06T06:57:00Z-
dc.date.available2010-09-06T06:57:00Z-
dc.date.issued2009en_HK
dc.identifier.citationInternational Journal Of Advanced Manufacturing Technology, 2009, v. 42 n. 7-8, p. 725-734en_HK
dc.identifier.issn0268-3768en_HK
dc.identifier.urihttp://hdl.handle.net/10722/74017-
dc.description.abstractThis paper introduces a new method to detect for solder paste defects on printed circuit board. This method not only recognizes volumetric defect but also shape deformity. It involves the use of the region-based classification technique. The 3D profile of solder paste block is first reconstructed using phase shift profilometry. The reconstructed 3D profile is then divided into several regions by geometric segmentation. The resulted regions include edges and top surface. Several features which represent their regions most are extracted and analyzed from the solder paste blocks. Regional classifiers are applied to process these feature spaces. The classifier outputs are then combined to form final detection result for each solder paste block. The performance of the region-based defect detection method is evaluated using 150 and 200 μm solder paste blocks. © 2008 Springer-Verlag London Limited.en_HK
dc.languageengen_HK
dc.publisherSpringer U K. The Journal's web site is located at http://www.springer.com/engineering/production+eng/journal/170en_HK
dc.relation.ispartofInternational Journal of Advanced Manufacturing Technologyen_HK
dc.rightsThe original publication is available at www.springerlink.com-
dc.subjectClassificationen_HK
dc.subjectFeature extractionen_HK
dc.subjectGeometric segmentationen_HK
dc.subjectInspectionen_HK
dc.subjectSolder paste defectsen_HK
dc.titleSolder paste inspection using region-based defect detectionen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0268-3768&volume=42&issue=7-8&spage=725&epage=734&date=2009&atitle=Solder+paste+inspection+using+region-based+defect+detectionen_HK
dc.identifier.emailPang, GKH:gpang@eee.hku.hken_HK
dc.identifier.authorityPang, GKH=rp00162en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s00170-008-1639-6en_HK
dc.identifier.scopuseid_2-s2.0-67349115432en_HK
dc.identifier.hkuros168563en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-67349115432&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume42en_HK
dc.identifier.issue7-8en_HK
dc.identifier.spage725en_HK
dc.identifier.epage734en_HK
dc.identifier.isiWOS:000266093200011-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridHui, TW=23667519200en_HK
dc.identifier.scopusauthoridPang, GKH=7103393283en_HK

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