File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Efficient numerical modeling of random rough surface effects in interconnect resistance extraction

TitleEfficient numerical modeling of random rough surface effects in interconnect resistance extraction
Authors
KeywordsInterconnect simulation
Power loss
Resistance extraction
Rough surface effects
Issue Date2009
PublisherJohn Wiley & Sons Ltd. The Journal's web site is located at http://www3.interscience.wiley.com/cgi-bin/jhome/1976
Citation
International Journal Of Circuit Theory And Applications, 2009, v. 37 n. 6, p. 751-763 How to Cite?
AbstractOwing to the decreasing skin depth in high-speed analog and digital circuits, surface roughness is playing an increasingly important role in interconnect parasitic extraction. However, the random nature of surface roughness and the complicated electromagnetic behavior baffle satisfactory solutions to the extraction exercise. This paper utilizes a numerically formulated effective conductivity as an efficient measure of the rough surface effects in the resistance extraction to avoid the global discretization of interconnect surfaces. Two numerical methods based on different boundary element formulations are proposed to compute the mean effective conductivity for interconnects with random surface roughness. Numerical experiments compare these two methods in different rough surface patterns to evaluate their efficacy. Copyright© 2008 John Wiley and Sons, Ltd.
Persistent Identifierhttp://hdl.handle.net/10722/73826
ISSN
2015 Impact Factor: 1.179
2015 SCImago Journal Rankings: 0.384
ISI Accession Number ID
Funding AgencyGrant Number
Hong Kong Research Grants CouncilHKU 7174/07E
University Research Committee of the University of Hong Kong
Funding Information:

Contract/grant sponsor: University Research Committee of the University of Hong Kong

References

 

DC FieldValueLanguage
dc.contributor.authorChen, Qen_HK
dc.contributor.authorWong, Nen_HK
dc.date.accessioned2010-09-06T06:55:08Z-
dc.date.available2010-09-06T06:55:08Z-
dc.date.issued2009en_HK
dc.identifier.citationInternational Journal Of Circuit Theory And Applications, 2009, v. 37 n. 6, p. 751-763en_HK
dc.identifier.issn0098-9886en_HK
dc.identifier.urihttp://hdl.handle.net/10722/73826-
dc.description.abstractOwing to the decreasing skin depth in high-speed analog and digital circuits, surface roughness is playing an increasingly important role in interconnect parasitic extraction. However, the random nature of surface roughness and the complicated electromagnetic behavior baffle satisfactory solutions to the extraction exercise. This paper utilizes a numerically formulated effective conductivity as an efficient measure of the rough surface effects in the resistance extraction to avoid the global discretization of interconnect surfaces. Two numerical methods based on different boundary element formulations are proposed to compute the mean effective conductivity for interconnects with random surface roughness. Numerical experiments compare these two methods in different rough surface patterns to evaluate their efficacy. Copyright© 2008 John Wiley and Sons, Ltd.en_HK
dc.languageengen_HK
dc.publisherJohn Wiley & Sons Ltd. The Journal's web site is located at http://www3.interscience.wiley.com/cgi-bin/jhome/1976en_HK
dc.relation.ispartofInternational Journal of Circuit Theory and Applicationsen_HK
dc.subjectInterconnect simulationen_HK
dc.subjectPower lossen_HK
dc.subjectResistance extractionen_HK
dc.subjectRough surface effectsen_HK
dc.titleEfficient numerical modeling of random rough surface effects in interconnect resistance extractionen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, Q: q1chen@hku.hken_HK
dc.identifier.emailWong, N: nwong@eee.hku.hken_HK
dc.identifier.authorityChen, Q=rp01688en_HK
dc.identifier.authorityWong, N=rp00190en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1002/cta.492en_HK
dc.identifier.scopuseid_2-s2.0-68149117207en_HK
dc.identifier.hkuros164698en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-68149117207&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume37en_HK
dc.identifier.issue6en_HK
dc.identifier.spage751en_HK
dc.identifier.epage763en_HK
dc.identifier.isiWOS:000268760900002-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridChen, Q=18133382800en_HK
dc.identifier.scopusauthoridWong, N=35235551600en_HK

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats