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Conference Paper: Fabrication of matrix-addressable micro-LED arrays based on a novel etch technique

TitleFabrication of matrix-addressable micro-LED arrays based on a novel etch technique
Authors
KeywordsA1. Etching
B1. Nitrides
B3. Light emitting diodes
B3. Microdisplays
Issue Date2004
PublisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/jcrysgro
Citation
Journal Of Crystal Growth, 2004, v. 268 n. 3-4 SPEC. ISS., p. 527-530 How to Cite?
AbstractA novel method of etching which allows the direct interconnection of multiple GaN-based devices is introduced. The mesa structures of devices are etched using an isotropic recipe which produces tapered sidewalls. The extent of inclination can be readily controlled through various etching parameters, which include the ICP power, plate power and pressure, thus modifying the vertical and lateral etch components. This approach has been successfully adopted in the fabrication of interconnect and matrix-addressable micro-LEDs, which offer superior optical and electrical performance and a high degree of uniformity compared to similar devices fabricated using conventional processes. © 2004 Elsevier B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/73743
ISSN
2015 Impact Factor: 1.462
2015 SCImago Journal Rankings: 0.752
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorChoi, HWen_HK
dc.contributor.authorJeon, CWen_HK
dc.contributor.authorDawson, MDen_HK
dc.date.accessioned2010-09-06T06:54:20Z-
dc.date.available2010-09-06T06:54:20Z-
dc.date.issued2004en_HK
dc.identifier.citationJournal Of Crystal Growth, 2004, v. 268 n. 3-4 SPEC. ISS., p. 527-530en_HK
dc.identifier.issn0022-0248en_HK
dc.identifier.urihttp://hdl.handle.net/10722/73743-
dc.description.abstractA novel method of etching which allows the direct interconnection of multiple GaN-based devices is introduced. The mesa structures of devices are etched using an isotropic recipe which produces tapered sidewalls. The extent of inclination can be readily controlled through various etching parameters, which include the ICP power, plate power and pressure, thus modifying the vertical and lateral etch components. This approach has been successfully adopted in the fabrication of interconnect and matrix-addressable micro-LEDs, which offer superior optical and electrical performance and a high degree of uniformity compared to similar devices fabricated using conventional processes. © 2004 Elsevier B.V. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/jcrysgroen_HK
dc.relation.ispartofJournal of Crystal Growthen_HK
dc.rightsJournal of Crystal Growth . Copyright © Elsevier BV.en_HK
dc.subjectA1. Etchingen_HK
dc.subjectB1. Nitridesen_HK
dc.subjectB3. Light emitting diodesen_HK
dc.subjectB3. Microdisplaysen_HK
dc.titleFabrication of matrix-addressable micro-LED arrays based on a novel etch techniqueen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0022-0248&volume=268&spage=527&epage=&date=2004&atitle=Fabrication+of+Matrix-addressable+Micro-LED+Arrays+Based+on+a+Novel+Etch+Techniqueen_HK
dc.identifier.emailChoi, HW:hwchoi@eee.hku.hken_HK
dc.identifier.authorityChoi, HW=rp00108en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.jcrysgro.2004.04.085en_HK
dc.identifier.scopuseid_2-s2.0-3142718267en_HK
dc.identifier.hkuros109866en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-3142718267&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume268en_HK
dc.identifier.issue3-4 SPEC. ISS.en_HK
dc.identifier.spage527en_HK
dc.identifier.epage530en_HK
dc.identifier.isiWOS:000223087000036-
dc.publisher.placeNetherlandsen_HK
dc.identifier.scopusauthoridChoi, HW=7404334877en_HK
dc.identifier.scopusauthoridJeon, CW=7006894315en_HK
dc.identifier.scopusauthoridDawson, MD=7203061779en_HK

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