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Article: Soil-nail pullout interaction in loose fill materials

TitleSoil-nail pullout interaction in loose fill materials
Authors
KeywordsFills
Interfaces
Laboratory tests
Parameters
Pull-out resistance
Soil nailing
Issue Date2006
PublisherAmerican Society of Civil Engineers. The Journal's web site is located at http://ascelibrary.aip.org/gmo/
Citation
International Journal Of Geomechanics, 2006, v. 6 n. 4, p. 238-247 How to Cite?
AbstractA laboratory study was conducted to investigate the behavior of soil nails embedded in loosely compacted sandy fills. By varying the overburden pressure, the peak pullout force and the load-displacement behavior were determined by carrying out pullout tests in a displacement-rate controlled manner. The test results were compared to other published ones. The present results show that the pullout resistance can be interpreted with conventional soil parameters. The effect of retrained dilatancy, which is considered to be the reason for high pullout resistance in dense materials, is negligible in loose fill materials except under very low stress level. Furthermore, pullout resistance increases with overburden pressure opposed to some field test results reported in the literature which show no systematic trend in pullout resistance with overburden pressure. A numerical model was developed to simulate the mobilization of pullout force in soil nails. It has been shown that a simple one-dimensional spring model can be used to simulate the pullout load-displacement relationship. © 2006 ASCE.
Persistent Identifierhttp://hdl.handle.net/10722/71776
ISSN
2015 Impact Factor: 1.387
2015 SCImago Journal Rankings: 1.762
References

 

DC FieldValueLanguage
dc.contributor.authorPradhan, Ben_HK
dc.contributor.authorTham, LGen_HK
dc.contributor.authorYue, ZQen_HK
dc.contributor.authorJunaideen, SMen_HK
dc.contributor.authorLee, CFen_HK
dc.date.accessioned2010-09-06T06:35:04Z-
dc.date.available2010-09-06T06:35:04Z-
dc.date.issued2006en_HK
dc.identifier.citationInternational Journal Of Geomechanics, 2006, v. 6 n. 4, p. 238-247en_HK
dc.identifier.issn1532-3641en_HK
dc.identifier.urihttp://hdl.handle.net/10722/71776-
dc.description.abstractA laboratory study was conducted to investigate the behavior of soil nails embedded in loosely compacted sandy fills. By varying the overburden pressure, the peak pullout force and the load-displacement behavior were determined by carrying out pullout tests in a displacement-rate controlled manner. The test results were compared to other published ones. The present results show that the pullout resistance can be interpreted with conventional soil parameters. The effect of retrained dilatancy, which is considered to be the reason for high pullout resistance in dense materials, is negligible in loose fill materials except under very low stress level. Furthermore, pullout resistance increases with overburden pressure opposed to some field test results reported in the literature which show no systematic trend in pullout resistance with overburden pressure. A numerical model was developed to simulate the mobilization of pullout force in soil nails. It has been shown that a simple one-dimensional spring model can be used to simulate the pullout load-displacement relationship. © 2006 ASCE.en_HK
dc.languageengen_HK
dc.publisherAmerican Society of Civil Engineers. The Journal's web site is located at http://ascelibrary.aip.org/gmo/en_HK
dc.relation.ispartofInternational Journal of Geomechanicsen_HK
dc.rightsInternational Journal of Geomechanics . Copyright © American Society of Civil Engineers.en_HK
dc.subjectFillsen_HK
dc.subjectInterfacesen_HK
dc.subjectLaboratory testsen_HK
dc.subjectParametersen_HK
dc.subjectPull-out resistanceen_HK
dc.subjectSoil nailingen_HK
dc.titleSoil-nail pullout interaction in loose fill materialsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1532-3641&volume=6&issue=4&spage=238&epage=247&date=2006&atitle=Soil-nail+pullout+interaction+in+loose+fill+materialsen_HK
dc.identifier.emailTham, LG: hrectlg@hku.hken_HK
dc.identifier.emailYue, ZQ: yueqzq@hku.hken_HK
dc.identifier.emailLee, CF: leecf@hkucc.hku.hken_HK
dc.identifier.authorityTham, LG=rp00176en_HK
dc.identifier.authorityYue, ZQ=rp00209en_HK
dc.identifier.authorityLee, CF=rp00139en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1061/(ASCE)1532-3641(2006)6:4(238)en_HK
dc.identifier.scopuseid_2-s2.0-33746067462en_HK
dc.identifier.hkuros118337en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33746067462&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume6en_HK
dc.identifier.issue4en_HK
dc.identifier.spage238en_HK
dc.identifier.epage247en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridPradhan, B=14042411600en_HK
dc.identifier.scopusauthoridTham, LG=7006213628en_HK
dc.identifier.scopusauthoridYue, ZQ=7102782735en_HK
dc.identifier.scopusauthoridJunaideen, SM=6504204671en_HK
dc.identifier.scopusauthoridLee, CF=8068602600en_HK

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