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Article: Thermal stress analysis for laminated plates using actual temperature field

TitleThermal stress analysis for laminated plates using actual temperature field
Authors
KeywordsActual temperature fields
Finite elements
Global-local higher order model
Laminated composite plates
Issue Date2007
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/ijmecsci
Citation
International Journal Of Mechanical Sciences, 2007, v. 49 n. 11, p. 1276-1288 How to Cite?
AbstractA global-local higher order model considering transverse normal deformation is proposed to predict the thermal response of laminated plates subjected to actual temperature field. The in-plane temperature field is expressed as a harmonic series expansion whereas the nonlinear temperature profile in the thickness direction is determined by solving the heat conduction equation. Validity of the proposed model is verified by comparing results with existing publications. Moreover, influence of the temperature fields along the thickness direction on the thermal behaviors of laminates is also investigated. Numerical results show that present model can reasonably predict thermal response of general laminated plates as well as laminated plates with arbitrary layouts under actual temperature loads. However, higher-order zigzag theory neglecting transverse normal deformation is inadequate for predicting thermal response of laminated plates subjected to actual temperature fields. A merit of the present model is that transverse shear stresses can be evaluated directly from the constitutive equations without stress smoothing. © 2007 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/71292
ISSN
2015 Impact Factor: 2.481
2015 SCImago Journal Rankings: 1.464
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorWu, Zen_HK
dc.contributor.authorCheng, YKen_HK
dc.contributor.authorLo, SHen_HK
dc.contributor.authorChen, Wen_HK
dc.date.accessioned2010-09-06T06:30:40Z-
dc.date.available2010-09-06T06:30:40Z-
dc.date.issued2007en_HK
dc.identifier.citationInternational Journal Of Mechanical Sciences, 2007, v. 49 n. 11, p. 1276-1288en_HK
dc.identifier.issn0020-7403en_HK
dc.identifier.urihttp://hdl.handle.net/10722/71292-
dc.description.abstractA global-local higher order model considering transverse normal deformation is proposed to predict the thermal response of laminated plates subjected to actual temperature field. The in-plane temperature field is expressed as a harmonic series expansion whereas the nonlinear temperature profile in the thickness direction is determined by solving the heat conduction equation. Validity of the proposed model is verified by comparing results with existing publications. Moreover, influence of the temperature fields along the thickness direction on the thermal behaviors of laminates is also investigated. Numerical results show that present model can reasonably predict thermal response of general laminated plates as well as laminated plates with arbitrary layouts under actual temperature loads. However, higher-order zigzag theory neglecting transverse normal deformation is inadequate for predicting thermal response of laminated plates subjected to actual temperature fields. A merit of the present model is that transverse shear stresses can be evaluated directly from the constitutive equations without stress smoothing. © 2007 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/ijmecscien_HK
dc.relation.ispartofInternational Journal of Mechanical Sciencesen_HK
dc.subjectActual temperature fieldsen_HK
dc.subjectFinite elementsen_HK
dc.subjectGlobal-local higher order modelen_HK
dc.subjectLaminated composite platesen_HK
dc.titleThermal stress analysis for laminated plates using actual temperature fielden_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0020-7403&volume=49&issue=11&spage=1276&epage=1288&date=2007&atitle=Thermal+stress+analysis+for+laminated+plates+using+actual+temperature+fielden_HK
dc.identifier.emailLo, SH:hreclsh@hkucc.hku.hken_HK
dc.identifier.authorityLo, SH=rp00223en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.ijmecsci.2007.03.007en_HK
dc.identifier.scopuseid_2-s2.0-35348905545en_HK
dc.identifier.hkuros152304en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-35348905545&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume49en_HK
dc.identifier.issue11en_HK
dc.identifier.spage1276en_HK
dc.identifier.epage1288en_HK
dc.identifier.isiWOS:000251070400008-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridWu, Z=37125456500en_HK
dc.identifier.scopusauthoridCheng, YK=23066557100en_HK
dc.identifier.scopusauthoridLo, SH=7401542444en_HK
dc.identifier.scopusauthoridChen, W=8503539200en_HK

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