File Download
There are no files associated with this item.
Links for fulltext
(May Require Subscription)
- Publisher Website: 10.1016/0013-7944(94)90142-2
- Scopus: eid_2-s2.0-0028433546
- WOS: WOS:A1994NK57600006
- Find via
Supplementary
- Citations:
- Appears in Collections:
Article: Boundary collocation method for cracks emanating from a hole in an anisotropic plate
Title | Boundary collocation method for cracks emanating from a hole in an anisotropic plate |
---|---|
Authors | |
Issue Date | 1994 |
Publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmech |
Citation | Engineering Fracture Mechanics, 1994, v. 48 n. 1, p. 53-62 How to Cite? |
Abstract | The stress intensity factors (SIFs) for the cracks emanating from a hole in an anisotropic finite plate are analyzed by the boundary collocation method (BCM). This method is a semi-analytic and a semi-discrete method. The stress functions are assumed such that not only the governing equations of the anisotropic plate in the domain, but also the free boundary conditions on the crack surfaces and the stress singularity at the crack tip have been satisfied. Therefore, only the boundary conditions on the hole and the boundaries of the plate need to be considered, and they can be satisfied approximately by the least square method. Some numerical examples are given and a series of advantages of the method are demonstrated. © 1994. |
Persistent Identifier | http://hdl.handle.net/10722/71268 |
ISSN | 2023 Impact Factor: 4.7 2023 SCImago Journal Rankings: 1.232 |
ISI Accession Number ID |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Wang, YH | en_HK |
dc.contributor.author | Cheung, YK | en_HK |
dc.date.accessioned | 2010-09-06T06:30:26Z | - |
dc.date.available | 2010-09-06T06:30:26Z | - |
dc.date.issued | 1994 | en_HK |
dc.identifier.citation | Engineering Fracture Mechanics, 1994, v. 48 n. 1, p. 53-62 | en_HK |
dc.identifier.issn | 0013-7944 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/71268 | - |
dc.description.abstract | The stress intensity factors (SIFs) for the cracks emanating from a hole in an anisotropic finite plate are analyzed by the boundary collocation method (BCM). This method is a semi-analytic and a semi-discrete method. The stress functions are assumed such that not only the governing equations of the anisotropic plate in the domain, but also the free boundary conditions on the crack surfaces and the stress singularity at the crack tip have been satisfied. Therefore, only the boundary conditions on the hole and the boundaries of the plate need to be considered, and they can be satisfied approximately by the least square method. Some numerical examples are given and a series of advantages of the method are demonstrated. © 1994. | en_HK |
dc.language | eng | en_HK |
dc.publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmech | en_HK |
dc.relation.ispartof | Engineering Fracture Mechanics | en_HK |
dc.title | Boundary collocation method for cracks emanating from a hole in an anisotropic plate | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0013-7944&volume=48&issue=1&spage=53&epage=62&date=1994&atitle=Boundary+collocation+method+for+cracks+emanating+from+a+hole+in+an+anisotropic+plate | en_HK |
dc.identifier.email | Cheung, YK:hreccyk@hkucc.hku.hk | en_HK |
dc.identifier.authority | Cheung, YK=rp00104 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1016/0013-7944(94)90142-2 | - |
dc.identifier.scopus | eid_2-s2.0-0028433546 | en_HK |
dc.identifier.hkuros | 1195 | en_HK |
dc.identifier.volume | 48 | en_HK |
dc.identifier.issue | 1 | en_HK |
dc.identifier.spage | 53 | en_HK |
dc.identifier.epage | 62 | en_HK |
dc.identifier.isi | WOS:A1994NK57600006 | - |
dc.publisher.place | United Kingdom | en_HK |
dc.identifier.scopusauthorid | Wang, YH=9737738500 | en_HK |
dc.identifier.scopusauthorid | Cheung, YK=7202111065 | en_HK |
dc.identifier.issnl | 0013-7944 | - |