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Article: Stress intensity factors for penny-shaped cracks perpendicular to graded interfacial zone of bonded bi-materials

TitleStress intensity factors for penny-shaped cracks perpendicular to graded interfacial zone of bonded bi-materials
Authors
KeywordsBi-materials
Boundary element method
Functionally graded materials
Generalized Kelvin solution
Interface
Penny-shaped crack
Stress intensity factors
Issue Date2005
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmech
Citation
Engineering Fracture Mechanics, 2005, v. 72 n. 1, p. 121-143 How to Cite?
AbstractThis paper examines the stress intensity factors that are associated with a penny-shaped crack perpendicular to the interface of a bi-material bonded with a graded interfacial zone. Elastic modulus of the graded interfacial zone is assumed to be an exponential function of the depth. The stress intensity factors are calculated numerically using a so-called generalized Kelvin solution based boundary element method. Three cases of normal or shear tractions acting on the crack surfaces are examined. Values of the stress intensity factors are examined by taking into account the effects of the following four parameters: (a) the crack front position; (b) the non-homogeneity parameter of the graded interfacial zone; (c) the crack distance to the graded interfacial zone; and (d) the graded interfacial zone thickness. The numerical results are compared well with existing solutions under some degenerated conditions. These results are useful to furthering our knowledge on fracture behavior of bi-material systems with or without a graded interfacial zone. © 2004 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/71149
ISSN
2015 Impact Factor: 2.024
2015 SCImago Journal Rankings: 1.423
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorXiao, HTen_HK
dc.contributor.authorYue, ZQen_HK
dc.contributor.authorTham, LGen_HK
dc.contributor.authorChen, YRen_HK
dc.date.accessioned2010-09-06T06:29:21Z-
dc.date.available2010-09-06T06:29:21Z-
dc.date.issued2005en_HK
dc.identifier.citationEngineering Fracture Mechanics, 2005, v. 72 n. 1, p. 121-143en_HK
dc.identifier.issn0013-7944en_HK
dc.identifier.urihttp://hdl.handle.net/10722/71149-
dc.description.abstractThis paper examines the stress intensity factors that are associated with a penny-shaped crack perpendicular to the interface of a bi-material bonded with a graded interfacial zone. Elastic modulus of the graded interfacial zone is assumed to be an exponential function of the depth. The stress intensity factors are calculated numerically using a so-called generalized Kelvin solution based boundary element method. Three cases of normal or shear tractions acting on the crack surfaces are examined. Values of the stress intensity factors are examined by taking into account the effects of the following four parameters: (a) the crack front position; (b) the non-homogeneity parameter of the graded interfacial zone; (c) the crack distance to the graded interfacial zone; and (d) the graded interfacial zone thickness. The numerical results are compared well with existing solutions under some degenerated conditions. These results are useful to furthering our knowledge on fracture behavior of bi-material systems with or without a graded interfacial zone. © 2004 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmechen_HK
dc.relation.ispartofEngineering Fracture Mechanicsen_HK
dc.subjectBi-materialsen_HK
dc.subjectBoundary element methoden_HK
dc.subjectFunctionally graded materialsen_HK
dc.subjectGeneralized Kelvin solutionen_HK
dc.subjectInterfaceen_HK
dc.subjectPenny-shaped cracken_HK
dc.subjectStress intensity factorsen_HK
dc.titleStress intensity factors for penny-shaped cracks perpendicular to graded interfacial zone of bonded bi-materialsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0013-7944&volume=72&spage=121&epage=143&date=2004&atitle=Stress+intensity+factors+for+penny-shaped+cracks+perpendicular+to+graded+interfacial+zone+of+bonded+bi-materialsen_HK
dc.identifier.emailYue, ZQ:yueqzq@hkucc.hku.hken_HK
dc.identifier.emailTham, LG:hrectlg@hkucc.hku.hken_HK
dc.identifier.authorityYue, ZQ=rp00209en_HK
dc.identifier.authorityTham, LG=rp00176en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.engfracmech.2004.03.005en_HK
dc.identifier.scopuseid_2-s2.0-10044232854en_HK
dc.identifier.hkuros91820en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-10044232854&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume72en_HK
dc.identifier.issue1en_HK
dc.identifier.spage121en_HK
dc.identifier.epage143en_HK
dc.identifier.isiWOS:000224447900006-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridXiao, HT=7401565578en_HK
dc.identifier.scopusauthoridYue, ZQ=7102782735en_HK
dc.identifier.scopusauthoridTham, LG=7006213628en_HK
dc.identifier.scopusauthoridChen, YR=22978389000en_HK
dc.identifier.citeulike7350530-

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