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Article: Analysis of an elliptical crack parallel to graded interfacial zone of bonded bi-materials

TitleAnalysis of an elliptical crack parallel to graded interfacial zone of bonded bi-materials
Authors
KeywordsBi-materials
Boundary element method
Elliptical crack
Functionally graded materials
Generalized Kelvin solution
Stress intensity factors
Issue Date2005
PublisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/mechmat
Citation
Mechanics Of Materials, 2005, v. 37 n. 7, p. 785-799 How to Cite?
AbstractThis paper analyzes an elliptical crack parallel to the functionally graded interfacial zone between two fully bonded solids. The functionally graded interfacial zone is treated as a nonhomogeneous solid layer with its elastic modulus varying in the thickness direction. A generalized Kelvin solution based boundary element method is employed for the calculation of the stress intensity factors associated with the three-dimensional crack problem. The elliptical crack surface is subject to either uniform normal traction or uniform shear traction. The stress intensity factors are examined by taking into account the effects of the nonhomogeneity parameter and thickness of the functionally graded interfacial zone, as well as the crack distance to the zone. The numerical results are in very good agreement with the existing solutions under degenerated conditions. These stress intensity factor values can be further used to predict the crack growth in the functionally graded materials. © 2004 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/70846
ISSN
2015 Impact Factor: 2.636
2015 SCImago Journal Rankings: 1.311
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorXiao, HTen_HK
dc.contributor.authorYue, ZQen_HK
dc.contributor.authorTham, LGen_HK
dc.date.accessioned2010-09-06T06:26:38Z-
dc.date.available2010-09-06T06:26:38Z-
dc.date.issued2005en_HK
dc.identifier.citationMechanics Of Materials, 2005, v. 37 n. 7, p. 785-799en_HK
dc.identifier.issn0167-6636en_HK
dc.identifier.urihttp://hdl.handle.net/10722/70846-
dc.description.abstractThis paper analyzes an elliptical crack parallel to the functionally graded interfacial zone between two fully bonded solids. The functionally graded interfacial zone is treated as a nonhomogeneous solid layer with its elastic modulus varying in the thickness direction. A generalized Kelvin solution based boundary element method is employed for the calculation of the stress intensity factors associated with the three-dimensional crack problem. The elliptical crack surface is subject to either uniform normal traction or uniform shear traction. The stress intensity factors are examined by taking into account the effects of the nonhomogeneity parameter and thickness of the functionally graded interfacial zone, as well as the crack distance to the zone. The numerical results are in very good agreement with the existing solutions under degenerated conditions. These stress intensity factor values can be further used to predict the crack growth in the functionally graded materials. © 2004 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/mechmaten_HK
dc.relation.ispartofMechanics of Materialsen_HK
dc.rightsMechanics of Materials. Copyright © Elsevier BV.en_HK
dc.subjectBi-materialsen_HK
dc.subjectBoundary element methoden_HK
dc.subjectElliptical cracken_HK
dc.subjectFunctionally graded materialsen_HK
dc.subjectGeneralized Kelvin solutionen_HK
dc.subjectStress intensity factorsen_HK
dc.titleAnalysis of an elliptical crack parallel to graded interfacial zone of bonded bi-materialsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0167-6636&volume=37&spage=785&epage=799&date=2004&atitle=Analysis+of+an+elliptical+crack+parallel+to+graded+interfacial+zone+of+bonded+bi-materialsen_HK
dc.identifier.emailYue, ZQ:yueqzq@hkucc.hku.hken_HK
dc.identifier.emailTham, LG:hrectlg@hkucc.hku.hken_HK
dc.identifier.authorityYue, ZQ=rp00209en_HK
dc.identifier.authorityTham, LG=rp00176en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.mechmat.2004.06.005en_HK
dc.identifier.scopuseid_2-s2.0-14844358554en_HK
dc.identifier.hkuros97515en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-14844358554&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume37en_HK
dc.identifier.issue7en_HK
dc.identifier.spage785en_HK
dc.identifier.epage799en_HK
dc.identifier.isiWOS:000228139000005-
dc.publisher.placeNetherlandsen_HK
dc.identifier.scopusauthoridXiao, HT=7401565578en_HK
dc.identifier.scopusauthoridYue, ZQ=7102782735en_HK
dc.identifier.scopusauthoridTham, LG=7006213628en_HK

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