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Article: An embedded bond-slip model for finite element modelling of soil-nail interaction

TitleAn embedded bond-slip model for finite element modelling of soil-nail interaction
Authors
KeywordsEmbedded bond-slip
Embedded element
Finite element modelling
Interface element
Soil nail
Issue Date2009
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/compgeo
Citation
Computers And Geotechnics, 2009, v. 36 n. 6, p. 1090-1097 How to Cite?
AbstractSoil nailing has been widely used as a reinforcing technique to retain excavations and stabilise slopes. Proper assessment of the interaction between the nails and the surrounding soil is central to safe and economical design of the composite reinforced soil structure. In this note, a new interface model, denoted as "embedded bond-slip model", is proposed to model the soil-nail interaction numerically in a simplified manner. Combining the key features of the embedded element technique and the conventional interface element method, the proposed plane-strain interface model has the advantages that no special considerations have to be given to the arrangement of the finite element mesh for the soil nails, and that possible tangential slippage along the interface can be modelled. The formulation also allows pore water flow across the soil nails to be incorporated into the analysis. The proposed model has been implemented into a finite element code and verified by simple element tests under different uni-direction loading conditions. Using the proposed interface model, back analyses of a field test involving a soil-nailed cut slope subjected to a rise in groundwater table have been conducted. This note presents the details of the embedded bond-slip model and the numerical results which demonstrate that the proposed model is capable of simulating soil-nail interaction conveniently and realistically. © 2009 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/70813
ISSN
2015 Impact Factor: 1.705
2015 SCImago Journal Rankings: 2.033
ISI Accession Number ID
Funding AgencyGrant Number
University of Hong Kong7176/05E
7171/06E
Funding Information:

The authors acknowledge the support by Grant Nos. 7176/05E and 7171/06E of the University of Hong Kong.

References

 

DC FieldValueLanguage
dc.contributor.authorZhou, YDen_HK
dc.contributor.authorCheuk, CYen_HK
dc.contributor.authorTham, LGen_HK
dc.date.accessioned2010-09-06T06:26:21Z-
dc.date.available2010-09-06T06:26:21Z-
dc.date.issued2009en_HK
dc.identifier.citationComputers And Geotechnics, 2009, v. 36 n. 6, p. 1090-1097en_HK
dc.identifier.issn0266-352Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/70813-
dc.description.abstractSoil nailing has been widely used as a reinforcing technique to retain excavations and stabilise slopes. Proper assessment of the interaction between the nails and the surrounding soil is central to safe and economical design of the composite reinforced soil structure. In this note, a new interface model, denoted as "embedded bond-slip model", is proposed to model the soil-nail interaction numerically in a simplified manner. Combining the key features of the embedded element technique and the conventional interface element method, the proposed plane-strain interface model has the advantages that no special considerations have to be given to the arrangement of the finite element mesh for the soil nails, and that possible tangential slippage along the interface can be modelled. The formulation also allows pore water flow across the soil nails to be incorporated into the analysis. The proposed model has been implemented into a finite element code and verified by simple element tests under different uni-direction loading conditions. Using the proposed interface model, back analyses of a field test involving a soil-nailed cut slope subjected to a rise in groundwater table have been conducted. This note presents the details of the embedded bond-slip model and the numerical results which demonstrate that the proposed model is capable of simulating soil-nail interaction conveniently and realistically. © 2009 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/compgeoen_HK
dc.relation.ispartofComputers and Geotechnicsen_HK
dc.subjectEmbedded bond-slipen_HK
dc.subjectEmbedded elementen_HK
dc.subjectFinite element modellingen_HK
dc.subjectInterface elementen_HK
dc.subjectSoil nailen_HK
dc.titleAn embedded bond-slip model for finite element modelling of soil-nail interactionen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0266-352X&volume=36&spage=1090&epage=1097&date=2009&atitle=An+embedded+bond-slip+model+for+finite+element+modelling+of+soil-nail+interactionen_HK
dc.identifier.emailZhou, YD: zhouyuande@gmail.comen_HK
dc.identifier.emailTham, LG: hrectlg@hku.hken_HK
dc.identifier.authorityZhou, YD=rp00215en_HK
dc.identifier.authorityTham, LG=rp00176en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.compgeo.2009.03.002en_HK
dc.identifier.scopuseid_2-s2.0-67349089961en_HK
dc.identifier.hkuros162453en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-67349089961&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume36en_HK
dc.identifier.issue6en_HK
dc.identifier.spage1090en_HK
dc.identifier.epage1097en_HK
dc.identifier.isiWOS:000267314300019-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridZhou, YD=7405363896en_HK
dc.identifier.scopusauthoridCheuk, CY=16240702800en_HK
dc.identifier.scopusauthoridTham, LG=7006213628en_HK
dc.identifier.citeulike5330956-

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