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Conference Paper: Nickel suppression in Ni-Ti alloys by plasma immersion ion implantation surface treatment: New materials for orthopaedic implantation

TitleNickel suppression in Ni-Ti alloys by plasma immersion ion implantation surface treatment: New materials for orthopaedic implantation
Authors
Issue Date2005
PublisherSwiss Society for Biomaterials. The Journal's web site is located at http://www.ecmjournal.org
Citation
European Cells And Materials, 2005, v. 10 SUPPL.3, p. 78 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/68189
ISSN
2015 Impact Factor: 3.654
2015 SCImago Journal Rankings: 1.771
References

 

DC FieldValueLanguage
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorPoon, RWYen_HK
dc.contributor.authorLiu, Xen_HK
dc.contributor.authorHo, JPYen_HK
dc.contributor.authorChung, CYen_HK
dc.contributor.authorChu, PKen_HK
dc.contributor.authorLu, WWen_HK
dc.contributor.authorChan, Den_HK
dc.contributor.authorCheung, KMCen_HK
dc.date.accessioned2010-09-06T06:02:12Z-
dc.date.available2010-09-06T06:02:12Z-
dc.date.issued2005en_HK
dc.identifier.citationEuropean Cells And Materials, 2005, v. 10 SUPPL.3, p. 78en_HK
dc.identifier.issn1473-2262en_HK
dc.identifier.urihttp://hdl.handle.net/10722/68189-
dc.languageengen_HK
dc.publisherSwiss Society for Biomaterials. The Journal's web site is located at http://www.ecmjournal.orgen_HK
dc.relation.ispartofEuropean Cells and Materialsen_HK
dc.titleNickel suppression in Ni-Ti alloys by plasma immersion ion implantation surface treatment: New materials for orthopaedic implantationen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1473-2262&volume=10&issue=3&spage=78&epage=&date=2005&atitle=Nickel+suppression+in+Ni-Ti+alloys+by+plasma+immersion+ion+implantation+surface+treatment:+new+materials+for+orthopaedic+implantationen_HK
dc.identifier.emailYeung, KWK:wkkyeung@hkucc.hku.hken_HK
dc.identifier.emailChan, D:chand@hkucc.hku.hken_HK
dc.identifier.emailCheung, KMC:cheungmc@hku.hken_HK
dc.identifier.authorityYeung, KWK=rp00309en_HK
dc.identifier.authorityChan, D=rp00540en_HK
dc.identifier.authorityCheung, KMC=rp00387en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-84860734971en_HK
dc.identifier.hkuros121633en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-84860734971&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume10en_HK
dc.identifier.issueSUPPL.3en_HK
dc.identifier.spage78en_HK
dc.identifier.epage78en_HK
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridYeung, KWK=13309584700en_HK
dc.identifier.scopusauthoridPoon, RWY=55211838300en_HK
dc.identifier.scopusauthoridLiu, X=55049440200en_HK
dc.identifier.scopusauthoridHo, JPY=55211809500en_HK
dc.identifier.scopusauthoridChung, CY=55210738900en_HK
dc.identifier.scopusauthoridChu, PK=55012538700en_HK
dc.identifier.scopusauthoridLu, WW=54989091200en_HK
dc.identifier.scopusauthoridChan, D=7402216545en_HK
dc.identifier.scopusauthoridCheung, KMC=7402406754en_HK

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