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Article: Aggressiveness of self-etch adhesives on unground enamel

TitleAggressiveness of self-etch adhesives on unground enamel
Authors
Issue Date2004
PublisherOperative Dentistry. The Journal's web site is located at http://www.jopdent.org
Citation
Operative Dentistry, 2004, v. 29 n. 3, p. 309-316 How to Cite?
AbstractManufacturers of mild self-etch adhesives advocate the adjunctive use of phosphoric acid etching when bonding to unground enamel. This study tested the null hypothesis that there is no difference between the recently introduced, more aggressive self-etch adhesives and a total-etch adhesive in bonding to unground enamel. The ultrastructure and microtensile bond strengths (μTBS) of Xeno III (Dentsply) and Simplicity (Apex Dental Materials), bonded to unground enamel, were examined after thermocycling. Clearfil SE Bond (Kuraray), a mild self-etch adhesive, was used as the negative control, and One-Step (BISCO), a total-etch adhesive bonded to phosphoric acid-etched unground enamel, was used as the positive control. Differences in the thickness of enamel hybrid layers were observed and the aggressiveness of apatite dissolution in the four adhesives.
Persistent Identifierhttp://hdl.handle.net/10722/66689
ISSN
2015 Impact Factor: 2.819
2015 SCImago Journal Rankings: 0.641
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorTay, FRen_HK
dc.contributor.authorPashley, DHen_HK
dc.contributor.authorKing, NMen_HK
dc.contributor.authorCarvalho, RMen_HK
dc.contributor.authorTsai, Jen_HK
dc.contributor.authorLai, SCNen_HK
dc.contributor.authorMarquezini Jr, Len_HK
dc.date.accessioned2010-09-06T05:48:29Z-
dc.date.available2010-09-06T05:48:29Z-
dc.date.issued2004en_HK
dc.identifier.citationOperative Dentistry, 2004, v. 29 n. 3, p. 309-316en_HK
dc.identifier.issn0361-7734en_HK
dc.identifier.urihttp://hdl.handle.net/10722/66689-
dc.description.abstractManufacturers of mild self-etch adhesives advocate the adjunctive use of phosphoric acid etching when bonding to unground enamel. This study tested the null hypothesis that there is no difference between the recently introduced, more aggressive self-etch adhesives and a total-etch adhesive in bonding to unground enamel. The ultrastructure and microtensile bond strengths (μTBS) of Xeno III (Dentsply) and Simplicity (Apex Dental Materials), bonded to unground enamel, were examined after thermocycling. Clearfil SE Bond (Kuraray), a mild self-etch adhesive, was used as the negative control, and One-Step (BISCO), a total-etch adhesive bonded to phosphoric acid-etched unground enamel, was used as the positive control. Differences in the thickness of enamel hybrid layers were observed and the aggressiveness of apatite dissolution in the four adhesives.en_HK
dc.languageengen_HK
dc.publisherOperative Dentistry. The Journal's web site is located at http://www.jopdent.orgen_HK
dc.relation.ispartofOperative Dentistryen_HK
dc.titleAggressiveness of self-etch adhesives on unground enamelen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0361-7734&volume=29 No3&spage=311&epage=318&date=2004&atitle=Aggressiveness+of+self-etch+adhesives+on+unground+enamelen_HK
dc.identifier.emailKing, NM: hhdbknm@hkucc.hku.hken_HK
dc.identifier.authorityKing, NM=rp00006en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.pmid15195732-
dc.identifier.scopuseid_2-s2.0-2942582880en_HK
dc.identifier.hkuros85854en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-2942582880&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume29en_HK
dc.identifier.issue3en_HK
dc.identifier.spage309en_HK
dc.identifier.epage316en_HK
dc.identifier.isiWOS:000221412700011-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridTay, FR=7102091962en_HK
dc.identifier.scopusauthoridPashley, DH=35448600800en_HK
dc.identifier.scopusauthoridKing, NM=7201762850en_HK
dc.identifier.scopusauthoridCarvalho, RM=7103357029en_HK
dc.identifier.scopusauthoridTsai, J=7403610711en_HK
dc.identifier.scopusauthoridLai, SCN=7402937128en_HK
dc.identifier.scopusauthoridMarquezini Jr, L=13409944800en_HK

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