File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Incompatibility of Self-etch Adhesives with Chemical/Dual-cured Composites: Two-step vs One-step Systems

TitleIncompatibility of Self-etch Adhesives with Chemical/Dual-cured Composites: Two-step vs One-step Systems
Authors
Issue Date2003
PublisherOperative Dentistry. The Journal's web site is located at http://www.jopdent.org
Citation
Operative Dentistry, 2003, v. 28 n. 6, p. 747-755 How to Cite?
AbstractThis study tested the null hypothesis that there is no difference between two-step and one-step self-etch adhesives in their compatibility with these composites. The microtensile bond strengths (μTBS) of two two-step systems (Clearfil SE Bond, Kuraray and Tyrian SPE/One-Step Plus, BISCO) were compared with two one-step systems (Xeno III, Dentsply DeTrey and Brush&Bond, Parkell) for their coupling to a dual-cured composite. Silver tracer penetration of the four adhesives bonded to a light-cured or a chemical-cured composite was examined using TEM. Significant differences in μTBSs between composite curing modes were seen only in the one-step adhesives. For one-step self-etch adhesives bonded to the chemical-cured composite, TEM revealed signs of frank composite uncoupling along the adhesive-composite interface, which may be attributed to the adverse chemical interaction between the acidic adhesive and the composite. In addition, "water trees" that represent channels of increased permeability with the polymerized adhesive layer were also observed in the one-step adhesives. Both features were absent along the resin-dentin interfaces when chemical-cured composites were coupled to the two-step self-etch adhesives.
Persistent Identifierhttp://hdl.handle.net/10722/66519
ISSN
2015 Impact Factor: 2.819
2015 SCImago Journal Rankings: 0.641
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorCheong, Cen_HK
dc.contributor.authorKing, NMen_HK
dc.contributor.authorPashley, DHen_HK
dc.contributor.authorFerrari, Men_HK
dc.contributor.authorToledano, Men_HK
dc.contributor.authorTay, FRen_HK
dc.date.accessioned2010-09-06T05:47:02Z-
dc.date.available2010-09-06T05:47:02Z-
dc.date.issued2003en_HK
dc.identifier.citationOperative Dentistry, 2003, v. 28 n. 6, p. 747-755en_HK
dc.identifier.issn0361-7734en_HK
dc.identifier.urihttp://hdl.handle.net/10722/66519-
dc.description.abstractThis study tested the null hypothesis that there is no difference between two-step and one-step self-etch adhesives in their compatibility with these composites. The microtensile bond strengths (μTBS) of two two-step systems (Clearfil SE Bond, Kuraray and Tyrian SPE/One-Step Plus, BISCO) were compared with two one-step systems (Xeno III, Dentsply DeTrey and Brush&Bond, Parkell) for their coupling to a dual-cured composite. Silver tracer penetration of the four adhesives bonded to a light-cured or a chemical-cured composite was examined using TEM. Significant differences in μTBSs between composite curing modes were seen only in the one-step adhesives. For one-step self-etch adhesives bonded to the chemical-cured composite, TEM revealed signs of frank composite uncoupling along the adhesive-composite interface, which may be attributed to the adverse chemical interaction between the acidic adhesive and the composite. In addition, "water trees" that represent channels of increased permeability with the polymerized adhesive layer were also observed in the one-step adhesives. Both features were absent along the resin-dentin interfaces when chemical-cured composites were coupled to the two-step self-etch adhesives.en_HK
dc.languageengen_HK
dc.publisherOperative Dentistry. The Journal's web site is located at http://www.jopdent.orgen_HK
dc.relation.ispartofOperative Dentistryen_HK
dc.subject.meshAdhesivenessen_HK
dc.subject.meshCompomers - chemistryen_HK
dc.subject.meshComposite Resins - chemistryen_HK
dc.subject.meshDental Bonding - methodsen_HK
dc.subject.meshDental Etching - methodsen_HK
dc.subject.meshDentin - ultrastructureen_HK
dc.subject.meshDentin-Bonding Agents - chemistryen_HK
dc.subject.meshHumansen_HK
dc.subject.meshLighten_HK
dc.subject.meshMaterials Testingen_HK
dc.subject.meshMethacrylates - chemistryen_HK
dc.subject.meshMicroscopy, Electronen_HK
dc.subject.meshPermeabilityen_HK
dc.subject.meshPolymers - chemistryen_HK
dc.subject.meshResin Cements - chemistryen_HK
dc.subject.meshSurface Propertiesen_HK
dc.subject.meshTensile Strengthen_HK
dc.subject.meshWater - chemistryen_HK
dc.titleIncompatibility of Self-etch Adhesives with Chemical/Dual-cured Composites: Two-step vs One-step Systemsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0361-7734&volume=28&issue=6&spage=747&epage=755&date=2003&atitle=Incompatibility+of+self-etch+adhesives+with+chemical/dual-cured+composites:+Two-step+vs+one-step+systems++en_HK
dc.identifier.emailCheong, C: cheongch@hkucc.hku.hken_HK
dc.identifier.emailKing, NM: hhdbknm@hkucc.hku.hken_HK
dc.identifier.authorityCheong, C=rp00034en_HK
dc.identifier.authorityKing, NM=rp00006en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.pmid14653290-
dc.identifier.scopuseid_2-s2.0-0345447129en_HK
dc.identifier.hkuros85106en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0345447129&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume28en_HK
dc.identifier.issue6en_HK
dc.identifier.spage747en_HK
dc.identifier.epage755en_HK
dc.identifier.isiWOS:000186401600014-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridCheong, C=7004368071en_HK
dc.identifier.scopusauthoridKing, NM=7201762850en_HK
dc.identifier.scopusauthoridPashley, DH=35448600800en_HK
dc.identifier.scopusauthoridFerrari, M=7401754964en_HK
dc.identifier.scopusauthoridToledano, M=7005372500en_HK
dc.identifier.scopusauthoridTay, FR=7102091962en_HK

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats