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Article: Effect of dentinal surface preparation on bond strength of self-etching adhesives

TitleEffect of dentinal surface preparation on bond strength of self-etching adhesives
Authors
KeywordsDentin
Microtensile bond strength
Self-etching adhesive
Surface preparation
Issue Date2008
PublisherQuintessence Publishing Co Ltd. The Journal's web site is located at http://www.quintessencepublishing.co.uk/catalog/product_info.php?cPath=3&products_id=243
Citation
Journal Of Adhesive Dentistry, 2008, v. 10 n. 3, p. 173-182 How to Cite?
AbstractPurpose: This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (μTBS) of two self-etching adhesive systems. Materials and Methods: Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For μTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The μTBS data were analyzed using two-way ANOVA and Tukey's multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM. Results: Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The μTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 ± 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 ± 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 ± 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets. Conclusion: Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.
Persistent Identifierhttp://hdl.handle.net/10722/66062
ISSN
2015 Impact Factor: 1.594
2015 SCImago Journal Rankings: 0.486
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorYiu, CKYen_HK
dc.contributor.authorHiraishi, Nen_HK
dc.contributor.authorKing, NMen_HK
dc.contributor.authorTay, FRen_HK
dc.date.accessioned2010-09-06T05:43:16Z-
dc.date.available2010-09-06T05:43:16Z-
dc.date.issued2008en_HK
dc.identifier.citationJournal Of Adhesive Dentistry, 2008, v. 10 n. 3, p. 173-182en_HK
dc.identifier.issn1461-5185en_HK
dc.identifier.urihttp://hdl.handle.net/10722/66062-
dc.description.abstractPurpose: This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (μTBS) of two self-etching adhesive systems. Materials and Methods: Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For μTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The μTBS data were analyzed using two-way ANOVA and Tukey's multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM. Results: Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The μTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 ± 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 ± 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 ± 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets. Conclusion: Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.en_HK
dc.languageengen_HK
dc.publisherQuintessence Publishing Co Ltd. The Journal's web site is located at http://www.quintessencepublishing.co.uk/catalog/product_info.php?cPath=3&products_id=243en_HK
dc.relation.ispartofJournal of Adhesive Dentistryen_HK
dc.subjectDentinen_HK
dc.subjectMicrotensile bond strengthen_HK
dc.subjectSelf-etching adhesiveen_HK
dc.subjectSurface preparationen_HK
dc.subject.meshAdhesivenessen_HK
dc.subject.meshCarbon Compounds, Inorganic - chemistryen_HK
dc.subject.meshComposite Resins - chemistryen_HK
dc.subject.meshDental Bondingen_HK
dc.subject.meshDental High-Speed Equipmenten_HK
dc.subject.meshDentin - ultrastructureen_HK
dc.subject.meshDentin-Bonding Agents - chemistryen_HK
dc.subject.meshDiamond - chemistryen_HK
dc.subject.meshHumansen_HK
dc.subject.meshMicroscopy, Electron, Scanningen_HK
dc.subject.meshResin Cements - chemistryen_HK
dc.subject.meshSilicon Compounds - chemistryen_HK
dc.subject.meshStress, Mechanicalen_HK
dc.subject.meshSurface Propertiesen_HK
dc.subject.meshTensile Strengthen_HK
dc.subject.meshTooth Preparation - instrumentation - methodsen_HK
dc.subject.meshTungsten Compounds - chemistryen_HK
dc.titleEffect of dentinal surface preparation on bond strength of self-etching adhesivesen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1461-5185&volume=10&spage=173&epage=182&date=2008&atitle=Effect+of+dentinal+surface+preparation+on+bond+strength+of+self-etching+adhesivesen_HK
dc.identifier.emailYiu, CKY: ckyyiu@hkucc.hku.hken_HK
dc.identifier.emailKing, NM: hhdbknm@hkucc.hku.hken_HK
dc.identifier.authorityYiu, CKY=rp00018en_HK
dc.identifier.authorityKing, NM=rp00006en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.pmid18652265-
dc.identifier.scopuseid_2-s2.0-46049111485en_HK
dc.identifier.hkuros148309en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-46049111485&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume10en_HK
dc.identifier.issue3en_HK
dc.identifier.spage173en_HK
dc.identifier.epage182en_HK
dc.identifier.isiWOS:000256917100003-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridYiu, CKY=7007115156en_HK
dc.identifier.scopusauthoridHiraishi, N=8925934400en_HK
dc.identifier.scopusauthoridKing, NM=7201762850en_HK
dc.identifier.scopusauthoridTay, FR=7102091962en_HK

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